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Instrumentation

Technical Equipment

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Scanning Probe Microscopy

STM

Low Temperature STM

  • Scanning tunnelling microscopy/spectroscopy at low temperature of down to 4.5 K
  • In situ epitaxial growth of molecular adlayers
  • Electrospray system for bulk and fragile molecules deposition
  • Low energy electron diffraction (LEED) measurements
  • Sputter anneal cycles of metal crystals
Tieftemperatur-STM

 

STM

Variable Temperature STM

  • In situ epitaxial growth of molecular adlayers
  • Low temperature scanning tunnelling microscopy with flowing cryostat
  • Low energy electron diffraction (LEED) measurements
  • Sputter anneal cycles of metal crystals
Variable Temperatur STM

 

STM

RHK 300

  • Ambient STM
  • SPM 1000 Electronics Controller
RHK 300

 

STM

Burleigh ambient STM

  • Ambient STM
  • Electronic controller system from Burleigh Instructional STM
  • Atomic Force Microscope (Burleigh)
  • Scanning Electrical Force Microscope (SEFM) (Extension of TopoMetrix AFM)
Burleigh ambient STM

 

Electron Microscopy

HRTEM

Philips CM 20 - currently not operational

  • 200 kV High Resolution Transmission Electron Microscope
  • Field Emission Gun (FEG)
  • Gatan Imaging Energy Filter (GIF)

 

SEM

FEI Nova NanoSEM 200

  • Schottky Field Emission Gun
  • Backscattered Electrons
  • Analytical Detectors for:
    • X-ray Microanalysis
    • Electron Backscattering Diffraction (EBSD)
    • Cathodolumineszenz
FEI Nova NanoSEM 200

Spectroscopy

EELS - LEED

  • EELS-LEED: Electron Energy Loss Spectroscopy - Low Energy Electron Diffraction
  • Equipped with a deflection unit, enables precise control over momentum transfer
  • High energy resolution is achieved
  • 0.01 invAngstrom momentum and 10 meV energy resolution
  • Measure low energy excitations (i.e., plasmons)
  • Unique homemade tool
EELS-LEED

Diffraction

SPA - LEED

  • SPA-LEED: Spot Profile Analysis - Low Energy Electron Diffraction
  • A unique tool, originally developed in Hannover by M. Henzler
  • Two geometries in reciprocal space: normal geometry of incidence and grazing geometry of incidence
  • Low-resolution scanning electron microscopy mode
  • CEM (channeltron electron multiplier) analyzes the reflected intensity and enables recording spot profiles
SPA-LEED

Transport

STM

4pp-STM/SEM

  • Transport experiments down to nanoscale
  • Four individually controlled STM-tips
  • High resolution SEM for observation and e-beam lithography
  • Flow cryostate for a wide temperature range
  • In situ epitaxial layer growth and characterization by LEED
Vier-Spitzen-STM/SEM

 

Magnetotransport

Magnetotransport

  • Electronic transport in low-dimensional nanostructures in dependence of a magnetic field from -4 to +4 T
  • The angle between the magnetic field and the sample is freely adjustable
  • Temperature dependent transport from 10 to 400 K
  • In situ growth of epitaxial thin films
  • Low energy electron diffraction (LEED) measurements

 

 

Mechanically Controllable Break Junction

 

MCBJ

  • Contacting of single molecules
  • Cooling possibility down to 70K
  • Stable atomic point contacts up to 1 hour

Light Microscopy

Optical Microscope

Keyence Digital Microscope VHX-500

  • Transmitted- and reflectet-light operation
  • Different objectiv lenses
  • Camera resolution 1600x1200 px
Keyence Digital Microscope VHX-500

Preparation

Ion Beam Milling System

Leica TIC020

  • Triple Ion Beam Milling System
  • Allows target preparation of samples for SEM analysis
  • Suitable for cross-section preparation of any material with little pre-preparation required
  • Different voltages and currents available
  • Time controlled
Leica TIC 020

 

Ion Beam Milling System

Leica TIC 3X

  • Triple Ion Beam Milling System
  • sample cross-sections and flat surfaces to be produced for SEM, EBSD and AFM examinations
  • Prepreparations may be required before use
  • Different voltages and currents available
  • Time controlled
Leica TIV 3X

 

Ion Milling System

Leica RES 102

  • Sample thinning and polishing
  • Different voltages and currents available
  • Time controlled
Leica RES 102

 

Mechanical Sample Processing

Leica TXP

  • Device for sample preparation
  • For cutting, milling, sawing, grinding, polishing samples before use / processing in TIC 3X or TIC 020
Leica TXP