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Professorship of Smart Systems Integration
Publications

Publications

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Year 2018

Books

Baum,M.; Lorenz,J.; Fader,R.; Rommel,M.; Danyluk,S.; Gillner,A.; Stollenwerk,J.; Blaesi,B.: Chapter Strukturierungsverfahren. in the book: Angewandte Nanotechnologie, ed. by Haas,K.-H.; Tovar,G. (2018) pp 72-96 (ISBN 978-3-8396-0918-7)
Otto,T.: Chapter Leitprojekt “Go Beyond 4.0”: Individualisierte Massenfertigung. in the book: Digitalisierung: Schlüsseltechnologien für Wirtschaft & Gesellschaft, 1st edition, ed. by Reimund Neugebauer (2018) pp 223-238 (ISBN 978-3-662-55889-8)
Poliks,M.D.; Blaudeck,T.: Hierarchical, Hybrid and Roll-to-Roll Manufacturing for Device Applications (Proceedings MRS Fall Meeting 2016, Symposium PM5), MRS Advances volume 2 issue 18, ed. by Poliks, M.D.; Blaudeck, T. (Ed.) (2018) (ISSN 2059-8521)

Papers

A.Kossmann; D.Adner; S.Schulze; Blaudeck,T.; Hermann,S.; C.Tegenkamp; Schulz,S.E.; H.Lang: Integration of covalent and non-covalent functionalized SWCNTs in FETs. ChemOnTubes, Biarritz, 2018 Apr 22-26
Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Toward Microsystems Application. Micromachines 2018, art. 589, 9, 11 (2018) (ISSN 2072-666X)
Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl Ionic Liquid for microsystems application. International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Kuwana (Japan), 2018 Apr 17-21; Proceedings, Conference Proceedings, IEEE xplore, pp 415-418
Arnold,B.; Wohlrab,D.; Meinecke,C.; Reuter,D.; Mehner,J.: Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery. International Journal of Biomedical Science and Engineering, 6, 1 (2018) pp 1-6
Baum,M.; Saeidi,N.; Vogel,K.; Schroeder,T.; Selvam,K.G.M.; Wiemer,M.; Otto,T.: An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization . International Ultrasonic Symposium, Kobe (Japan), 2018 Oct 22-25; Proceedings, 18326814 (2018) (ISBN 1948-5727, 1948-5719, 978-1-5386-3425-7, 978-1-5386-3426-4)
Boettger,S.; Bonitz,J.; Kini,M.; Schulz,S.E.; Hermann,S.: Adding CNT-based functionality to MEMS: A technology demonstration for strain and IR sensors on wafer scale. Mikro-Nano-Integration 2018, Dortmund, 2018 Oct 22-23; Proceedings, 7 (2018) pp 19-22 (ISBN 978-3-8007-4789-4)
Boettger,S.; Joehrmann,N.; Bonitz,J.; Wunderle,B.; Schulz,S.E.; Hermann,S.: Scaling up Integration of Carbon Nanotubes into Micro-Electro-Mechanical Systems. Smart Systems Integration (SSI), Dresden, 2018 Apr 11-12; Proceedings, pp 243-249 (ISBN 978-3-95735-082-4)
C.Zeiner; M.Polomoshnov; M.Mueller; E.Sowade; A.Guenther; N.Neumann; Seifert,T.; Blaudeck,T.; Hermann,S.; Baumann,R.R.; Wiemer,M.; Otto,T.: Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors . Smart Systems Integration (SSI), Dresden, 2018 Apr 11-12 pp 39-45 (ISBN 978-3-95735-082-4)
Christian Schliebe; Julian Noll; Sebastian Scharf; Thomas Gemming; Andreas Seifert; Stefan Spange; Daniel Lehmann; Dietrich R.T.Zahn; Benjamin Fiedler; Joachim Friedrich; Blaudeck,T.; Heinrich Lang: Nitrogen-containing porous carbon materials by twin polymerization. Colloid and Polymer Science, 296, 3 (2018) p 413–426 (ISSN 0303-402X)
Dittmar,N.; Kuechler,M.; Meinecke,C.; Reuter,D.; Otto,T.: Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff. . 14. Fachtagung Mikrosystemtechnik, Chemnitz, 2018 Oct 23-24; Proceedings, pp 125-130 (ISBN 978-3-00-060648-9)
Dittrich,C.; Forke,R.; Hiller,K.; Kreutziger,P.; Kuerschner,R.; Meinecke,C.; Reuter,D.; Weidlich,S.; Streit,P.; Hahn,S.: Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau.. 14. Fachtagung Mikrosystemtechnik, Chemnitz, 2018 Oct 23-24; Proceedings, pp 12-17 (ISBN 978-3-00-060648-9)
E.I.Zenkevich; A.S.Stupak; Blaudeck,T.; Stefan Krause; Christian von Borczyskowski: Formation of excited states and photoluminescence quenching in nanocomposites of semiconductor Quantum dots and dye molecules (Формирование возбужденных состояний и тушение фотолюминсценции в нанокомпозитах «полупроводниковая квантовая точка – молекула красителя»). 6. Physikerkongress der Republik Belarus (VI-ой КОНГРЕСС ФИЗИКОВ БЕЛАРУСИ - Посвященный Году науки в Республике Беларусь), Minsk, 2017 Nov 20-23; Programm (ПРОГРАММА), 6, 1 (2018) pp 9-9 (ISBN 978-985-7137-40-4)
Gadhiya,G.; Braemer,B.; Rzepka,S.: Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions. 7th Electronic System-Integration Technology Conference (ESTC) 2018, Dresden (Germany), 2018 Sep 18-21; Proceedings, pp 1-7
Geneiss,V.; Lueke,T.; Hedayat,C.; Wolf,M.; Janek,F.; Meissner,T.; Barth,M.; Eberhardt,W.; Zimmermann,S.; Otto,T.: Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed- Signal Systems with MID Technology. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), Apr 11-12; Proceedings, pp 488-491 (ISBN 978-3-95735-082-4)
Hafez,M.; Haas,S.; Loebel,K.-U.; Reuter,D.; Ramsbeck,M.; Schramm,M.; Horstmann,J.-T.; Otto,T.: Characterisation of MOS Transistors as an Electromechanical Transducer for Stress. Phys. Status Solidi A , 2018 (2018) pp 680-693
Hangmann,C.; Hedayat,C.; Hilleringmann,U.; Otto,T.: Stochastic Analyzes and Monte-Carlo Simulations of nonlinear and non-ideal Mixed-Signal Phase-Locked Loops. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 492-495 (ISBN 978-3-95735-082-4)
Hartmann,M.; Schubel,R.; Claus,M.; Jordan,R.; Schulz,S.E.; Hermann,S.: Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs. IOP Nanotechnology, 29 (2018) p 035203 (9pp)
Hartmann,M.; Toader,M.,; Schubel,R.; Claus,M.; Jordan,R.; Schulz,S.E.; Hermann,S.: Performance Improvements of CNTFETs by Polymer-based Doping Control. NanoS&T, Potsdam , 2018 Oct 24-26; Talk
Haugwitz,T.; Erben,J.; Neumann,N.; Reuter,D.; Plettemeier,D.: Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization. Silicon Photonics: From Fundamental Research to Manufacturing, Strasbourg (France), 2018 April 23 - 26; Proc. SPIE, 10686 (2018)
Hedayat,C.; Hilleringman,U.; Lange,S.; Schroeder,D.; Otto,T.: Induktive Ortungsverfahren zur Lokalisierung von Kleinstfunksensoren in kleinen Messvolumina. 23th Leibniz-Conference 2018 – Lokaliserungstechniken für IoT, Telematik und Industrie 4.0, Lichtenwalde (Germany), 2018 Nov 22-23; Proceedings, Abstracts der Konferenzbeiträge
Heinrich,K.; Martin,J.; Langenickel,J.; Selbmann,F.; Otto,T.: Integration of quantum dot sensitized solar cells onto technical textiles. European Advanced Materials Congress, Stockholm (Sweden), 2018 Aug 20-23; proceedings, p 118 (ISBN ISBN 978-91-88252-12-8)
Heinrich,K.; Martin,J.; Mehlhorn,H.; Langenickel,J.; Selbmann,F.; Hartwig,M.; Otto,T.: Challenges in transferring quantum dot sensitized solar cells on technical textiles. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 416-419 (ISBN 978-3-95735-082-4)
Hermann,S.; Mothes,S.; Hartmann,M.; Tittmann-Otto,J.; Schroeter,M.: Modeling and Technology Platform for Analog High Frequency Carbon Nanotube Transistors. DATE, Dresden, 2018 Mar 20; Talk
Hertel,S.; Schulte,W.; Weiser,M.; Becker,M.; Wiemer,M.; Otto,T.: Electrochemical deposition of reactive material systems for assembly and packaging applications. Mikro-Nano-Integration 2018, Dortmund, 2018 Oct 22-23; Proceedings, 92 (2018) pp 38-43 (ISBN ISBN 978-3-8007-4789-4)
Hertel,S.; Wiemer,M.; Otto,T.: Galvanische Aluminium-Abscheidung auf unerschiedlichen Startschichten für die Leiterplatten- und Mikrosystemtechnik. Jahrbuch der Oberflächentechnik, 74 (2018) pp 50-64 (ISBN ISBN 978-3-87480-349-6)
Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.; Friedrich,S.: Elektrochemische Abscheidung für die Leiterplatte. Elektronische Baugruppen und Leiterplatten 2018, Fellbach, 2018 Feb 20.-21.; Proceedings, 340 (2018) pp 203-209 (ISBN ISBN 978-3-96144-026-9)
Hiller,K.; Helke,C.; Seifert,M.; Seiler,J.; Kurth,S.; Meinig,M.; Wecker,J.: Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten. 14. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2019 Oct 23-24; Proceedings, pp 1-7 (ISBN ISBN 978-3-00-060648-9)
Hofmann,L.; Zienert,A.; Schuster,J.; Schulz,S.E.: Pulse Current Electrochemical Deposition of Copper for Through Silicon Vias in MEMS: Experiment and Simulation. Mikrosystemtechnik in Deutschland, pp 46-47 (ISBN ISSN 2191-7183)
Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,S.; Schulz,S.E.: Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer. 14. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2018 Oct 23.-24.; Proceedings, pp 110-115 (ISBN 978-3-00-060648-9)
Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,St.; Schulz,S.E.: Fabrication and Operation of Protein-Powered Biocomputation Devices based on Nanostructured Networks. Smart System Integration, Dresden, 2018 Apr 11-12; Proceedings, pp 102-109 (ISBN 978-3-95735-082-4)
Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,St.; Schulz,S.E.: Nanofabricated Networks used for Protein-Powered Biocomputation Devices . CAS 2018, 41st International Semiconductor Conference, Sinaia, Romania, 2018 Oct 10-12
Monteiro Diniz Reis,D.; Rzepka,S.; Hiller,K.: Reliability Testing of Integrated Low-Temperature PVD PZT Films. 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018); Microelectronics Reliability, 88–90 (2018) pp 835-839 (ISSN 00262714)
Noerdemann,A.: Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren. Bachelor Thesis, TU Chemnitz (Germany)
Otto,T.: Trends and Tendencies, New Examples,. Smart Systems Integration (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, Microsystems Technology in Germany 2018, pp 16-17 (ISSN 2191-7183)
Pousaneh,E.; Preuss,A.; Assim,Khaybar; Rueffer,T.; Korb,M.; Tittmann-Otto,J.; Hermann,S.; Schulz,S.E.; Lang,H.: Tetranuclear Y and Gd 2-Acetylcyclopentanoate Clusters: Synthesis and Their Use as Spin-Coating Precursors for Metal Oxide Film Formation for Field-Effect Transistor Fabrication. Journal of Rare Earths, p in press
Rizzi,L.; Zienert,A.; Schuster,J.; Koehne,M.; Schulz,S.E.: Electrical Conductivity Modeling of Graphene-based Conductor Materials. ACS Appl. Mater. Interfaces, 10 (2018) pp 43088-43094 (ISSN 1944-8244)
Rodemund,T.S.: Elektronentransport in Graphen-Nanobändern mit Kantenrauheit. Bachelor Thesis, TU Chemnitz (Germany)
Roessel,K.; Berger,B.; Mussenbrock,T.; Melzer,M.; Stoeckel,C.; Zimmermann,S.: MEMS based IEDF/IADF sensing: Kinetic analysis of the ion dynamics inside the sensor. 71st Annual Gaseous Electronics Conference, Portland, Oregon, 2018 Nov 5-9; Proceedings
Ruelke,S.; Zorn,W.; Meinig,M.; Wecker,J.; Reuter,D.; Deicke,F.; Clausner,A.; Werner,T.: Functional Integration - Structure-Integrated Wireless Sensor Technology Targeting Smart Mechanical Engineering Applications. Smart System Integration, Dresden, 2018 Apr 11-12; Proceedings
Schmidt,M.; Metz,G.; Hedayat,C.; Otto,T.; Petrov,D.: RFID Units for a Product Based Control of Industrial Production Systems. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2018), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 484-487 (ISBN 978-3-95735-082-4)
Schueller,M.; Lipowski,M.; Weigel,P.; Symmank,C.; Meynerts,L.; Walther,M.; Dziuba,F.; Otto,T.; Goetze,U.; Kroll,L.: Active flow control in wind turbines - integration technologies and assessment of economic effects. Smart Systems Integration Conference 2018 (SSI), Proceedings, pp. 500-503 , Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 500-503 (ISBN 978-3-95735-082-4)
Selbmann,F.; Baum,M.; Wiemer,M.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for electronic applications in space. 2018 IEEE, 68th Electronic Components and Technology Conference (ECTC 2018), San Diego, CA, USA, 2018 May 29-Jun 1; Proceedings, 17991851 (2018) pp 2205-2210 (ISBN 2377-5726, 978-1-5386-4999-2, 978-1-5386-5000-4)
Stoeckel,C.; Meinel,K.; Melzer,M.; Otto,T.: THIN FILM PIEZOELECTRIC ALUMINUM NITRIDE FOR PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS. IEEE Sensors 2018, Neu Dehli, Indien, October 28 - 31
Stupak,Alexander P.; Blaudeck,T.; Zenkevich,E.I.; Krause,S.; von Borczyskowsi,Christian: The nature of non-FRET photoluminescence quenching in nanoassemblies from semiconductor quantum dots and dye molecules . Phys. Chem. Chem. Phys., 20, 27 (2018) pp 18579-18600
Teichert,F.: Quantum transport in defective carbon nanotubes at mesoscopic length scales. Dissertation, TU Chemnitz (Germany)
Teichert,F.; Wagner,C.; Croy,A.; Schuster,J.: Influence of defect-induced deformations on electron transport in carbon nanotubes. Journal of Physics Communications, 2 (2018) p 115023 (ISSN 2399-6528)
Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electronic transport through defective semiconducting carbon nanotubes. Journal of Physics Communications, 2 (2018) p 105012 (ISSN 2399-6528)
Vogel,K.; Roscher,F.; Wiemer,M.; Zimmermann,S.; Otto,T.: Reactive bonding with oxide based reactive multilayers. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 71-78 (ISBN 978-3-95735-082-4)
Weissbach,M.; Auerswald,E.; Hildebrandt,M.; Rzepka,S.: Multiscale residual stress analysis in thin film layers. Konferenz Smart Systems Integration SSI, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 515-518 (ISBN 978-3-95735-082-4)
Wolf,M.; Janek,F.; Meissner,T.; Wigger,B.; Barth,M.; Guenter,T.; Eberhardt,W.; Zimmermann,A.; Geneiss,V.; Lueke,T.; Hedayat,C.; Otto,T.: Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing. 13th International Congress Molded Interconnect Devices (MID), 6 pages, Würzburg (Germany), 2018 Sep 25-26; Proceedings, IEEE Xplore Digital Library, 18232735 (2018) (ISBN 978-1-5386-4933-6, 978-1-5386-4932-9, 978-1-5386-4934-3)
Wuensch,D.; Schroeder,T.; Baum,M.; Hiller,K.; Forke,R.; Wiemer,M.; Weidenmueller,J.; Dogan,O.; Goertz,M.: 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate. Elektronische Baugruppen und Leiterplatten EBL 2018, Fellbach, 2018 Feb 20-21; Proceedings, DVS-Berichte Band 340 (2018) pp 249-254 (ISBN 978-3-96144-026-9)
Zimmermann,S.; Haase,M.; Lang,N.; Roepke,J.; Schulz,S.E.; Otto,T.: The role of plasma analytics in leading-edge semiconductor technologies. Volume 58, Issue 5 18th Topical Conference for Plasma Technology , Göttingen (Germany), 2017 Feb 20–22; Contributions to Plasma Physics 2018, 58, 5 (2018) pp 367-376 (ISSN 1521-3986)