55 A Hybrid Chemical Mechanical Planarization (CMP) Model for Time-Dependent, Spatial Material Removal Rate Optimization

Autoren: Rothe, Tom*; Sampura, Yasa; Zienert, Andreas; Langer, Jan; Gottfried, Knut; Streiter, Reinhard; Schuster, Jörg; Philipossian, Ara; Kuhn, Harald
Quelle: International Conference on Planarization Technology (ICPT), 2022 Sep 27-29, Portland, OR (USA), 2022
Erscheinungsjahr: 2022

54 Automatic Analysis of CMP Dishing in Via Arrays from AFM Images

Autoren: Langer, Jan*; Zienert, Andreas; Hensel, Doreen; Hofmann, Lutz; Gottfried, Knut; Rothe, Tom
Quelle: International Conference on Planarization Technology (ICPT), 2022 Sep 27-29, Portland, OR (USA), 2022
Erscheinungsjahr: 2022

53 Inline Tilt Measurements of Sintered Dies by Optical Line Scanning as Quality Assessment Tool for Smart Production

Autoren: May, Daniel*; Heilmann, J.; Schulz, M.; Boschman, E.; Ras, M. Abo; Wunderle, B.
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 25-27 April 2022, St Julian, Malta. -IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-5836-8 ; Print on Demand(PoD) ISBN: 978-1-6654-5837-5

52 Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography

Autoren: Panahandeh, S.*; May, Daniel; Grosse-Kockert, C.; Stelzer, A.; Rabay, B.; Busse, D.; Wunderle, Bernhard; Abo Ras, M.
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 25-27 April 2022, St Julian, Malta. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-5836-8 ; Print on Demand(PoD) ISBN: 978-1-6654-5837-5

51 Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method

Autoren: Grosse-Kockert, Corinna; Abo Ras, Mohamad; May, Daniel; Cremieux-Trives, Alexandre; Loffler, Florian; Wunderle, Bernhard
Quelle: 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 28-30 September 2022, Dublin, Ireland. -IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-9229-4 ; Print on Demand(PoD) ISBN: 978-1-6654-9230-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

50 Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices

Autoren: May, Daniel*; Jbari, Kenza; Carisetti, Dominique; Borta-Boyon, Ana; Garabedian, Patrick; Ziaei, Afshin; Abo Ras, Mohamad; Wunderle, Bernhard
Quelle: 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-9229-4 ; Print on Demand(PoD) ISBN:978-1-6654-9230-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

49 SixthSense: Smart Integrated Extreme Environment Health Monitor with Sensory Feedback for Enhanced Situation Awareness

Autoren: Bijelic, Goran; Briz Iceta, Nerea; Stefanovic, Cedomir; Morschhauser, Andreas; Carballo Leyenda, Ana Belén; Paletta, Lucas; Falk, Andreas; Kostic, Milos; Strbac, Matija; Jorgovanovic, Nikola; Jobst, Gerhard; Paradiso, Rita; Magenes, Giovanni; Bolado, Pablo Fanjul; Vujic, Aleksandar; Eschenbacher, Philip
Quelle: 2022 IEEE-EMBS International Conference on Wearable and Implantable Body Sensor Networks (BSN), 2022 Sep 27-30, Ioannina (Greece). - IEEE Xplore, 2022. - 22213414
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-5925-9 ; Print on Demand(PoD) ISBN: 978-1-6654-5926-6 ; Electronic ISSN: 2376-8894 ; Print on Demand(PoD) ISSN: 2376-8886

48 Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling

Autoren: Sternberg, Maik*; Pareek, Kaushal Arun; May, Daniel; Ras, Mohamad Abo; Wunderle, Bernhard
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 25-27 April 2022, St Julian, Malta. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

47 Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography

Autoren: Pareek, Kaushal Arun*; May, Daniel; Meszmer, Peter; Ras, Mohamad Abo; Wunderle, Bernhard
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 25-27 April 2022, St Julian, Malta. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

46 Investigation of the impact of thermal aging of molding compounds on the solder joint fatigue of a VQFN package

Autoren: Zhang, Maofen*; Chan, Yuen Sing; Niessner, Richard Martin; Schuetz, Gerhard; Altieri-Weimar, Paola; Wunderle, Bernhard
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, 25-27 April 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

45 A numerical and experimental investigation of influential factors for solder joint reliability of power LEDs for automotive applications

Autoren: Shaygi, Mehrdad; Li, Muyuan; Lang, Kurt-Jürgen; Laux, Harald; Wunderle, Bernhard
Quelle: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, 25-27 April 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

44 Interaction of advanced copper metallization with the assembly and interconnection technology

Autoren: Losbichler, Daniel*; Klingler, Markus; Orso, Steffen; Wunderle, Bernhard
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, 25-27 April 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

43 Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design

Autoren: Pflugler, Nadine*; Breitenreiner, Sebastian; Pufall, Reinhard; Wunderle, Bernhard
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, 25-27 April 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

42 Accelerated Stress Testing and Failure Analysis of Thermal Greases

Autoren: Wunderle, Bernhard; May, Daniel; Li, Yanrong; Arnold, Jorg; Ras, Mohamad Abo
Quelle: 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 28-30 September 2022, Dublin, Ireland. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-9229-4 ; Print on Demand(PoD) ISBN:978-1-6654-9230-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

41 Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion

Autoren: Breitenreiner, Sebastian; Pflugler, Nadine; Pufall, Reinhard; Wunderle, Bernhard
Quelle: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 13-16 September 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8947-8 ; Print on Demand(PoD) ISBN:978-1-6654-8948-5

40 Spin-orbit torque mediated coupling of terahertz light with magnon modes in heavy-metal/ferromagnet heterostructures

Autoren: Salikhov, Ruslan; Ilyakov, Igor; Körber, Lukas; Kákay, Attila; Lenz, Kilian; Fassbender, Jürgen; Bonetti, Stefano; Hellwig, Olav; Lindner, Jürgen; Kovalev, Sergey
Quelle: DPG-Tagung Regensburg, 7. September 2022
Erscheinungsjahr: 2022

39 Passive, frequency-selective piezoelectric MEMS with wake-up electronics for ultra-low-power vibration sensors

Autoren: Stoeckel, Chris*; Shaporin, Alexey; Schaller, Falk; Melzer, Marcel; Forke, Roman; Zimmermann, Sven; Kuhn, Harald
Quelle: EASS 2022; 11th GMM-Symposium, 2022 July 05-06, Erfurt (Germany). - VDE , IEEE Xplore, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-3-8007-5896-8

38 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications

Autoren: Cirulis, Imants; Braun, Silvia; Vogel, Klaus; Roscher, Frank; Wiemer, Maik; Hiller, Karla; Kuhn, Harald
Quelle: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022 Sep 13-16, Sibiu (Romania). - IEEE Xplore, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8947-8 ; Print on Demand(PoD) ISBN:978-1-6654-8948-5

37 Imaging and control of nanomaterial-decorated micromotors

Autoren: Aziz, Azaam*; Nauber, Richard; Iglesias, Ana Sanchez; Liz-Marzan, Luis M.; Schmidt, Oliver G.; Medina-Sanchez, Mariana*
Quelle: International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS), 25-29 July 2022, Toronto, 1-6. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-5973-0 ; Print on Demand(PoD) ISBN: 978-1-6654-5974-7

36 In-Vitro Verifikation medizinischer Drucksensoren am dynamischen Gefäßmodell

Autoren: Friedemann, Marvin*; Voigt, Sebastian; Otto, Richard; Mehner, Jan
Quelle: 15. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 9./10. November 2022, Chemnitz, S. 134-138
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-3-00-073342-0

35 Lithographic performance of resist ma-N 1402 in an e-beam/i-line stepper intra-level mix and match approach

Autoren: Canpolat-Schmidt, Cansu Hanim; Heldt, Georg; Helke, Christian; Voigt, Anja; Reuter, Danny
Quelle: 2022, Jun 20-23, Leuven (Belgium). - SPIE Digital Library, 2022
Erscheinungsjahr: 2022

34 Liquid cooling solutions for Automotive HPC: Thermal path characterisation

Autoren: Grün, Tobias; May, Daniel; Straub, Hubert; Przemyslaw Jakub, Gromala; Wunderle, Bernhard; Verleysen, Willem
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, April 24-27, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN: 978-1-6654-5837-5

33 Structural-Thermal-Optical-Performance (STOP) Analysis of a Lens Stack for Realization of a Digital Twin of an automotive LiDAR

Autoren: Tavakolibasti, Majid*; Meszmer, Peter; Kettelgerdes, Marcel; Böttger, Gunnar; Elger, Gordon; Erdogan, Hüseyin; Seshaditya, Aditya; Wunderle, Bernhard
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, April 24-27, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

32 Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests

Autoren: Meszmer, Peter*; Prisacaru, Alexandru; Gromala, Przemyslaw Jakub; Wunderle, Bernhard
Quelle: 2022 23rd international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), Malta, April 24-27, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

31 Raman study of photoinduced changes in Cd-doped amorphous GeSe2 films

Autoren: Azhniuk, Yuriy M.*; Gomonnai, Alexander V.; Kryshenik, Volodymyr M.; Lopushansky, Vasyl V.; Loya, Vasyl Y.; Voynarovych, Ivan M.; Zahn, Dietrich R. T.
Quelle: In: Materials Today: Proceedings. - Elsevier BV. - 62. 2022, Part 9, S. 5759 - 5762. - XVIII International Freik Conference on Physics and Technology of Thin Films and Nanosystems
Erscheinungsjahr: 2022
ISBN/ ISSN: 2214-7853

30 Characterization of Ag-In-S films prepared by thermal evaporation

Autoren: Azhniuk, Yuriy M.*; Gomonnai, Alexander V.; Solonenko, Dmytro; Lopushansky, Vasyl V.; Loya, Vasyl Y.; Voynarovych, Ivan M.; Roman, Ivan Y.; Zahn, Dietrich R. T.
Quelle: In: Materials Today: Proceedings. - Elsevier BV. - 62. 2022, Part 9, S. 5745 - 5748. - XVIII International Freik Conference on Physics and Technology of Thin Films and Nanosystems
Erscheinungsjahr: 2022
ISBN/ ISSN: 2214-7853

29 Accelerated Stress Testing for High-Cycle Fatigue of thin Al Films on piezo-driven MEMS Cantilever

Autoren: Jöhrmann, Nathanael; Stöckel, Chris; Wunderle, Bernhard
Quelle: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 28-30 September 2022, Dublin, Ireland. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN: 978-1-6654-9229-4 ; Print on Demand(PoD) ISBN: 978-1-6654-9230-0 ; Electronic ISSN: 2474-1523 ; Print on Demand(PoD) ISSN: 2474-1515

28 Modular Probecard-Measurement Equipment for Automated Wafer-Level Characterization of High Precision MEMS Gyroscopes

Autoren: Weidlich, Sebastian; Forke, Roman; Hiller, Karla; Bülz, Daniel; Shaporin, Alexey; Kuhn, Harald
Quelle: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2022 May 8-11, Avignon (France), 1-4. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-1-6654-0282-8 ; 978-1-6654-0283-5 ; 2377-3480 ; 2377-3464

27 The BDRIE-HS* Technology Approach for Tiny Motion Detection with Improved Sensitivity and Noise Performance

Autoren: Forke, Roman; Hiller, Karla; Hahn, Susann; Shaporin, Alexey; Weidlich, Sebastian; Bülz, Daniel; Küchler, Matthias; Reuter, Danny; Helke, Christian; Wünsch, Dirk; Gottfried, Knut; Kuhn, Harald
Quelle: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2022, May 8-11, Avignon (France), 1-4. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-1-6654-0282-8 ; 978-1-6654-0283-5 ; 2377-3480 ; 2377-3464

26 Evolution of elctronic coupling in the mechanically controllable break junctions

Autoren: Lokamani, M.; Kilibarda, F.; Günther, F.; Kelling, J.; Strobel, Alexander; Zahn, Peter; Juckeland, G.; Gothelf, K.; Scheer, E.; Gemming, Sibylle; Erbe, A.
Quelle: DPG Regensburg 2022, 04.-09.09.2022, Regensburg, Germany. - Weinheim : Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 0420-0195

25 Growth and characterization of WSe2 on epitaxial graphene on SiC(0001)

Autoren: Schütze, Adrian; Schädlich, Philip; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, O54.2
Erscheinungsjahr: 2022
ISSN 0420-0195

24 Properties of epitaxial graphene on various SiC terminations and polytypes investigated by low-energy electron microscopy

Autoren: Schädlich, Philip; Pakdehi, Davood Momeni; Speck, Florian; Pierz, Klaus; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, O41.4
Erscheinungsjahr: 2022
ISSN 0420-0195

23 Buffer Layer Characterization of Epitaxial Graphene on Silicon Carbide with Scanning Tunneling Microscopy

Autoren: Harling, Benno; Sinterhauf, Anna; Richter, Peter; Schädlich, Philip; Seyller, Thomas; Wenderoth, Martin
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, O18.11
Erscheinungsjahr: 2022
ISSN 0420-0195

22 Vertical structure of Sb-intercalated quasi-freestanding graphene on SiC(0001)

Autoren: Lin, You-Ron; Wolff, Susanne; Hutter, Mark; Sobatch, Serguei; Lee, Tien-Lin; Tautz, F. Stefan; Seyller, Thomas; Kumpf, Cristian; Bocquet, François
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, O18.6
Erscheinungsjahr: 2022
ISSN 0420-0195

21 Intercalation of epitaxial graphene on SiC(0001) with sulfur

Autoren: Wolff, Susanne; Tilgner, Niclas; Rauschendorfer, Tassilo; Speck, Florian; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, O18.3
Erscheinungsjahr: 2022
ISSN 0420-0195

20 Growth of Crystalline High-Entropy Alloy thin Films by Magnetron Sputtering

Autoren: Schwarz, Holger; Uhlig, Thomas; Wong, Eric; Henning, Petter; Wagner, Guntram; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, DS20.43
Erscheinungsjahr: 2022
ISSN 0420-0195

19 Charge-transfer stabilization, modulation doping, and CDW phase in layered ferecrystal heterostructures

Autoren: Göhler, Fabian; Ramasubramanian, Shrinidhi; Rajak, Sanam K.; Rösch, Niels; Schütze, Adrian; Wolff, Susanne; Choffel, Marissa; Cordova, Dimitry L. M.; Johnson, David C.; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, DS22.7
Erscheinungsjahr: 2022
ISSN 0420-0195

18 Electronic Structure of [(SnSe)1+δ]m(TiSe2)n investigated by Photoelectron Spectroscopy

Autoren: Rösch, Niels; Göhler, Fabian; Hamann, Danielle; Jonson, David C.; Seyller, Thomas
Quelle: DPG-Tagung der Sektion Kondensierte Materie (SKM), 04.-09.09.2022, Regensburg, DS20.29
Erscheinungsjahr: 2022
ISSN 0420-0195

17 Characterization of interfacial parameters for lifetime modelling in modern optical sensor package assemblies

Autoren: Kniely, Rudolf*; Huber, Fabian; Heilmann, Jens; Schulz, Marcus; Wunderle, Bernhard
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Malta, April 24-27, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

16 Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation

Autoren: Forndran, Freerik*; Heilmann, Jens; Metzler, Martin; Leicht, Markus; Wunderle, Bernhard
Quelle: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), St Julian, Malta, April 24-27, 2022.. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-5836-8 ; Print on Demand(PoD) ISBN:978-1-6654-5837-5

15 SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

Autoren: Zhang, Maofen; Heilmann, Jens; Sing Chan, Yuen; Richard Niessner, Martin; Altieri-Weimar, Paola; Wunderle, Bernhard
Quelle: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, Sep. 13-16, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8947-8 ; Print on Demand(PoD) ISBN:978-1-6654-8948-5

14 Reliability and Lifetime Estimation of Sintered Silver Die Attach for Different Accelerated Testing Conditions

Autoren: Forndran, Freerik; Heilmann, Jens; Metzler, Martin; Leicht, Markus; Wunderle, Bernhard
Quelle: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, Sep. 13-16, 2022. - IEEE, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8947-8 ; Print on Demand(PoD) ISBN:978-1-6654-8948-5

13 Surface Transport Properties of Pb- and Sn-intercalated Graphene

Autoren: Gruschwitz, Markus; Ghosal, Chitran; Mamiyev, Zamin; Koch, Julian; Wolff, Susanne; Seyller, Thomas; Tegenkamp, Christoph
Quelle: DPG-Tagung Regensburg, 7. September 2022
Erscheinungsjahr: 2022
ISSN 0420-0195

12 Magnetization switching on self-assembled structure of alpha-helix-polyalanine molecules observed by ambient STM

Autoren: Nguyen, Thi Ngoc Ha; Rasabathina, Lokesh; Hellwig, Olav; Sharma, A.; Salvan, Georgeta; Yochelis, S.; Paltiel, Y.; Tegenkamp, Christoph
Quelle: DPG-Tagung Regensburg, 6. September 2022
Erscheinungsjahr: 2022
ISSN 0420-0195

11 MEMS-basierte Fingerprint-Architektur für Vertrauenswürdige Elektronik

Autoren: Schott, Christian; Meinel, Katja; Mayer, Franziska; Gupta, Dhruv Padam; Mittag, Sebastian; Hahn, Susann; Weidlich, Sebastian; Bülz, Daniel; Forke, Roman; Hiller, Karla; Kuhn, Harald; Heinkel, Ulrich
Quelle: 15. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2022 Nov 9-10, Chemnitz (Germany), 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-3-00-073342-0

10 Hochauflösende Projektions-Lithografie für die Herstellung von MEMS-Strukturen mit hohem Aspekt-Verhältnis und für Nano-Imprint-Lithografie Mastern für optische Gitter

Autoren: Schermer, Sebastian; Helke, Christian; Song, Danhe; Haase, Micha; Zorbach, Walter; Kneidinger, Andrea; Reuter, Danny; Kuhn, Harald
Quelle: 15. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2022 Nov 9-10, Chemnitz (Germany), 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-3-00-073342-0

9 Integration von thermosensitiven Polymeren in nanoskalige Kanäle zur Realisierung von mikrofluidischen Schaltungen

Autoren: Bickmann, Ch.; Meinecke, Christoph Robert; Korten, T.; Heldt, Georg; Hartmann, Susanne; Helke, Christian; Reuter, Danny; Schulz, Stefan E.
Quelle: 15. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2022 Nov 9-10, Chemnitz (Germany), 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-3-00-073342-0

8 Multi-Mode Silicon Waveguides at Long Infrared Wavelengths

Autoren: Wecker, Julia; Hiller, Karla; Großmann, Toni; Kurth, Steffen; Hahn, Susann; Saupe, Ray; Martin, Jörg; Weiß, Alexander; Kuhn, Harald
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE, 2022. - 22114735
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8849-5 ; Print on Demand(PoD) ISBN:978-1-6654-8850-1

7 High-resolution projection lithography for MEMS-applications using thick photoresist AZ 10XT

Autoren: Schermer, Sebastian; Helke, Christian; Song, Danhe; Reuter, Danny; Kuhn, Harald
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE, 2022. - 22114740
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-1-6654-8849-5 , 978-1-6654-8850-1

6 Fabrication of Nanoimprint-Lithography masters for optical nano gratings

Autoren: Helke, Christian; Haase, Micha; Reuter, Danny; Zorbach, Walter; Kneidinger, Andrea; Kuhn, Harald
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE, 2022. - 22114760
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8849-5 ; Print on Demand(PoD) ISBN:978-1-6654-8850-1

5 Functional CMOS extension with integrated carbon nano devices

Autoren: Böttger, Simon; Dietz, Franz; Hartmann, Martin; Dahra, Nipun; Kaulfersch, Eberhard; Hermann, Sascha
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE, 2022. - 22114738
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8849-5 ; Print on Demand(PoD) ISBN:978-1-6654-8850-1

4 Effect of Surface Uniformity and Droplet Volume on Actuation Voltage of PCB Based EWOD Microfluidic System

Autoren: Al-Mogahed, Wail*; Voigt, Sebastian*; Mehner, Jan*
Quelle: Smart Systems Integration (SSI), 27-28 April 2022, Grenoble, France, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: Electronic ISBN:978-1-6654-8849-5 ; Print on Demand(PoD) ISBN:978-1-6654-8850-1

3 The Role of Disorder in Elementary Photonic Components

Autoren: Röhlig, David; Kuhn, Eduard; Thranhardt, Angela; Otto, Thomas; Blaudeck, Thomas
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE Xplore, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-1-6654-8849-5 , 978-1-6654-8850-1

2 Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming

Autoren: Schlagmann, Moritz; Selbmann, Franz; Haubold, Marco; Vobl, Matthias; Otto, Thomas
Quelle: 2022 Smart Systems Integration (SSI), 2022 April 27-28, Grenoble (France). - IEEE Xplore, 2022
Erscheinungsjahr: 2022
ISBN/ ISSN: 978-1-6654-8849-5 , 978-1-6654-8850-1

1 Energy Transfer and Singlet Oxygen Generation in Semiconductor Quantum Dot Porphyrin Nanoassemblies

Autoren: Zenkevich, Eduard I.; Blaudeck, Thomas; Sheinin, V. B.; Selyshchev, Oleksandr; Kulikova, O. M.; Stroyuk, O. L.; Raievska, O. E.; Dzhagan, V. N.; Koifman, Oscar Iosiphovich; von Borczyskowski, C.; Zahn, Dietrich R. T.
Quelle: Molecular, Membrane and Cellular Foundations for the Functionality of Biosystems, International Scientific Conference of the 15th General Assembly of the Belarusian Society of Photobiologists and Biophysicists, 2022 Jun 15-17, Minsk (Belarus), 156. - Library.ru, 2022
Erscheinungsjahr: 2022