Publications
2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Year 2024
| Behl,C.; Behlert,R.; Seiler,J.; Helke,C.; Shaporin,A.; Hiller,K.: Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications. Micro, 4, 1 (2024) pp 142-156 |
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Bonitz,J.; Helke,C.; Dittmar,N.; Schermer,S.; Haase,M.; Hofmann,L.; Reuter,D.: Scalable fabrication approach for single pixel microlens arrays. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Bonitz,J.; Helke,C.; Dittmar,N.; Schermer,S.; Haase,M.; Hofmann,L.; Reuter,D.: Scalable fabrication approach and fill factor optimization for single pixel microlens arrays. Journal of Vacuum Science & Technology B, 42, 6 (2024) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Fischer,T.; Helke,C.; Haase,M.; Hanisch,A.; Hofmann,L.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding. 10th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024 Sep 11-13; Proceedings, pp 1-5 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis. ECS Journal of Solid State Science and Technology, 13, 10 (2024) |
| Forke,R.; Tsukamoto,T.; Shaporin,A.; Weidlich,S.; Buelz,D.; Hahn,S.; Tanaka,S.; Hiller,K.: Advancement in the MEMS Gyroscope from a Vibrating Tuning Fork to a Tuned Ring with Comb Electrodes. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Gottwald,M.; Hartmann,S.; Helke,C.; Sendel,M.; Biller,H.; Schirmer,M.; Reuter,D.: Progress on an Intra-Level Mix & Match approach of the chemically amplified positive-tone photoresist SX AR-P 7200.14 for EBL and i-line stepper lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Haase,M.; Sayyed,M.; Langer,J.; Reuter,D.; Kuhn,H.: About the Data Analysis of Optical Emission Spectra of Reactive Ion Etching Processes - The Method of Spectral Redundancy Reduction. Plasma, 7 (2024) pp 258-283 |
| Hartmann,S.; Gottwald,M.; Helke,C.; Dittmar,N.; Haase,M.; Linn,E.; Haedrich,M.; Reuter,D.: 2.5D Patterning of photonic structures by electron beam-based grayscale lithography processes. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Helke,C.; Schermer,S.; Hartmann,S.; Bonitz,J.; Haase,M.; Linn,E.; Haedrich,M.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: 2.5D-Patterning of photonic structures by electron beam and i-line stepper based grayscale lithography processes. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Helke,C.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: Intra-Level Mix & Match investigations of negative tone photoresists mr-EBL 6000.5 and ma-N 1402 for i-line stepper and electron beam lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Helke,C.; Seiler,J.; Meinig,M.; Grossmann,T.D.; Bonitz,J.; Haase,M.; Zimmermann,S.; Ebermann,M.; Kurth,S.; Reuter,D.; Hiller,K.: Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process.. EEJ Transactions on Electrical and Electronic Engineering 2024, 19, 5 (2024) pp 767-772 |
| Roehlig,D.; Kuhn,E.; Teichert,F.; Traehnhardt,A.; Blaudeck,T.: Function phononic crystals. Europhysics Letters, 145, 2 (2024) p 26001 (ISBN 0295-5075, 1286-4854) |
| Schermer,S.; Hartmann,S.; Gottwald,M.; Bieling,J.; Helke,C.; Haase,M.; Linn,E.; Haedrich,M.; Zanzal,A.; Rexnolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: Patterning of 2.5D grayscale structures by electron beam and i-line stepper lithography processes. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Schermer,S.; Helke,C.; Reinhardt,M.; Hartmann,S.; Tank,F.; Wecker,J.; Heldt,G.; Voigt,A.; Reuter,D.: Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach. Micro and Nano Engineering, 23, 100264 (2024) pp 1-6 |
| Schermer,S.; Helke,C.; Sake,B.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: 2.5D-patterning via i-line grayscale exposure for photonic structures and micro lens arrays. Novel Patterning Technologies , 2024 Apr 9; Proceedings, 12956 (2024) p 1 |
| Schermer,S.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Helke,C.; Bieling,J.; Voigt,A.; Reuter,D.: i-line grayscale exposure using ma-P 1200G resist series for industry applications. 50th International Micro and Nano Engineering Conference, Montpellier (France), 2024 Sep 16-19; Proceedings, pp 1-2 |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: Mode Localization and Frequency Modulation Sensing Using Superposed in-Phase and Anti-Phase Oscillations. IEEE MEMS, Austin, TX (USA), 2024 Jan 21-25; Proceedings (ISBN 979-8-3503-5792-9) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: High Sensitivity Mode-Localized Ring Resonator With Tunable Sensitivity. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
