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NEW: Students of the Master course »Micro and Nano Systems« should apply for a research project on Bildungsportal Sachsen.

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#317  

Topic:
Glass frit bonding plays a crucial role in microelectromechanical systems (MEMS) technology by providing excellent hermetic sealing, high process yield, and good reliability. It enables the encapsulation and sealing of MEMS components at the wafer or chip level, ensuring protection and enhancing device performance. The bonding process involves screen printing a glass paste, thermal conditioning, and thermo-compressive bonding, allowing for the incorporation of metallic lead-throughs and ensuring high bonding strength. Glass frit bonding techniques have been optimized to control the width and height of the bonding layer, improving bonding strength and reliability in MEMS packaging processes. Additionally, glass frit bonding facilitates the creation of vacuum packages for MEMS devices, enhancing resonant performance and quality factor by sealing vacuum inside the package. Modeling studies have shown that stress from the bonding process can impact sensor performance, highlighting the importance of precise bonding techniques in MEMS applications. ENAS is very experienced in the field of glass frit bonding and glass frit deposition using screen printing.
In this project, we would like to explore the capabilities of digital additive deposition technologies i) dispensing and ii) jetting for two different commercially available lead-free glass frit pastes. The advantage of the digital additive deposition is that they are mask free (only dxf. Is necessary to generate the tool path) and that they can be used when it comes to print on topographic surfaces.

Work tasks:
- Literature research on the state of the art, glass frit bonding
- Literature research on the state of the art, glass frit deposition using dispensing or jetting
- Layout and design using different software to generate tool paths
- Parameter studies using a Musashi dispensing tool to achieve reproducible printed voluminal (droplets or lines)
- Microscopy and characterization (i.e. 3D profil) of the printed samples
- Sample preparation (wafer and chips)
- Demonstration and Bonding tests on Wafer- or Chiplevel
- Bonding DOE`s and cross section preparation, SEM images
- summarizing the experimental results and metrological evaluation of the machined copper layers
- Preparation of a poster as well as the presentation and the defense of the thesis

Time: 3 months to 10 months, Lab time at least 1 or 2 days per week is estimated and should be spend as a minimum to perform the experiments

Hiwi: additional HIWI position possible

Supervisor:
Frank Roscher
Fraunhofer ENAS, Abt. Systems Packaging
Technologie-Campus 3
09126 Chemnitz
Tel.: 03 71 / 45 00 12 39
E-Mail: frank.roscher@enas.fraunhofer.de

Contact: Apply for this job by email

Possible as: Student Assistance, Bachelor-Thesis, Master-Thesis

Addressed topics: MEMS, Micro- and Nanoelectronics, Packaging

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Labels: Student research project   Student Assistance   Bachelor-Thesis   Master-Thesis   Diploma Thesis   PhD Position