Publikationen
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Jahr 2015
| Almeida,M.; Matthes,P.; Ueberschaer,O.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Laser Based Exchange Bias Setting Influence on Spin-Valve Sensors Magnetic Properties. Spinicur Summer School, Braga (Portugal), 2015 Sep 7-11; Proceedings |
| Almeida,M.; Ueberschaer,O.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Innovative 2D GMR sensors in monolithic integration for high-sensitivity applications. Nanotech 2015, Tokyo (Japan), 2015 Jan 26 - 30 |
| Blaudeck,T.; Adner,David; Hermann,S.; Lang,Heinrich; Gessner,T.; Schulz,S.E.: Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach. Microelectronic Engineering, 137 (2015) pp 135-140 |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Length separation of single-walled carbon nanotubes and influence on CNT-FET properties. IEEENano, Rome, 2015 Jul 27-30 |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Towards Giant Piezoresistance – Process Improvements for Highly Sensitive CNT-based-Sensors. IMTC 2015 Leigtweight Structures, Chemnitz, 2015 Oct 1-2; Conference Proceedings (ISBN 978-3-95735-025-1) |
| Dhakal,D.; Georgi,C.; Ecke,R.; Assim,K.; Schulz,S.E.; Bruener,P.; Grehl,T.; Lang,H.; Gessner,T.: XPS and LEIS investigations of ultrathin Cu2O deposited by atomic layer deposition and subsequent reduction to Cu. 18. Tagung Festkörper Analytik, Wien, 2015 July 6-8 |
| Dhakal,D.; Hu,X.; Georgi,C.; Schuster,J.; Ecke,R.; Schulz,S.E.; Gessner,T.: Growth Monitoring by XPS and LEIS Investigations of Ultrathin Copper Films Deposited by Atomic Layer Deposition. Symposium of the ALD-Lab, SEMICON Europa, Dresden, 2015 Oct 06-08 |
| Dinh,N.T.; Sowade,E.; Blaudeck,T.; Hermann,S.; Rodriguez,R.D.; Zahn,D.R.T.; Schulz,S.E.; Baumann,R.R.; Kanoun,O.: High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly. Carbon 09/2015, 96 (2015) pp 382-396 |
| Foerster,A.; Koehler,N.; Zimmermann,S.; Fischer,T.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.; Gessner,T.: Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Poster; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Foerster,A.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.: k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study . DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Talk; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Franz,M.; Ecke,R.; Kaufmann,C.; Kriz,J.; Schulz,S.E.: Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys. IITC/MAM, Grenoble, 2015; 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), pp 95-98 (ISBN 978-1-4673-7356-2) |
| Fuchs,F.; Zienert,A.; Wagner,C.; Schuster,J.; Schulz,S.E.: Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing. Microelectronic Eng., 137 (2015) pp 124-129 |
| Gessner,T.; Otto,T.; Schulz,S.E.; Hermann,S.; Blaudeck,T.; Spudat,C.: Vorrichtungen zur Aussendung und/oder zum Empfang elektromagnetischer Strahlung und Verfahren zur Bereitstellung derselben . DE102013221758 (A1) |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of integrated carbon nanotubes. 3rd Dresden Nanoanalysis symposium 2015, 2015 April 17 |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes. DPG 2015, 2015 Mar 15-20 |
| Hartmann,Steffen; Shaporin,A.; Hermann,S.; Bonitz,J.; Heggen,Marc; Markert,M.; Meszmer,Peter; Sturm,Heinz; Hoelck,Ole; Blaudeck,T.; Schulz,S.E.; Mehner,J.; Wunderle,B.; Gessner,T.: Towards Nanoreliability of CNT based Sensor Applications: Investigations of Carbon Nanotube-Metal Interfaces Combining Molecular Dynamics Simulations, Advanced In-Situ Experiments and Analytics. 16th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Budapest, 2015 April 19-22; Proceedings (ISBN 978-1-4799-9949-1) |
| Hermann,S.; Bonitz,J.; Boettger,S.; Hartmann,S; Shaporin,A.; Mehner,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Carbon Nanotube based sensors in MEMS/NEMS. SSI, Copenhagen, 2015 Mar 11-12 |
| Hille,Toni; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Optimizing Dispersion Preparation for the Wafer-Level Deposition of CNTs. DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Hofmann,L.; Dempwolf,S.; Reuter,D.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Knechtel,R.; Gessner,T.: 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding. SPIE Microtechnologies, Barcelona, Spain, 2015 May ; Proceedings of SPIE, 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 951709 (2015) |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. International Wafer-Level-Packaging Conference, San Jose, CA, USA, 2015 October 13-15; SMTA Proceedings |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface. Microelectronic Engineering, 137, 2 (2015) pp 23-31 |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate: a combined first-principles and reactive molecular dynamics study. Physical Chemistry Chemical Physics, 17 (2015) pp 26892-26902 |
| Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.; Gessner,T.: Reactive Molecular Dynamics Study of Copper Metal and Copper Oxide Atomic Layer Deposition from Copper(II) Acetylacetonate. 15th International Conference on Atomic Layer Deposition (ALD 2015), Portland (USA), June 28 - July 02 |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNTs growth: Comparative study on characterization techniques for an effective CVD process Development. NT, Nagoya(Japan) |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNT growth: Investigation of catalyst type, composition and structure. MC2015, Güttingen(Germany), 2015 Sep 7-11 |
| Kalbacova,Jana; Rodriguez,Raul D.; Blaudeck,T.; Hermann,S.; Adner,David; Lang,Heinrich; Schulz,S.E.; Zahn,Dietrich R.T.: Probing the structure of carbon nanotube bundles: A Raman spectroscopy study with metal nanoparticles. Optical Nanospectroscopy II, Dublin, 2015 Mar 18-20; Proceedings |
| Kaspar,M.; Waechtler,T.; Ecke,R.; Georgi,C.; Schulz,S.E.; Lang,H.; Gessner,T.: A Novel Dicobaltatetrahedrane Precursor Studied for the MOCVD of Cobalt Metal Layers (Poster). Materials for Advances Metalization (MAM), Grenoble, 2015 May 18 - 21 |
| Kasper,Laura; Adner,David; Blaudeck,T.; Hermann,S.; Lang,Heinrich; Schulz,S.E.: Wafer-level decoration of carbon nanotubes with preformed gold nanoparticles for optical sensing. 3rd Erlangen Symposium on Synthetic Carbon Allotropes (SCA 2015), Erlangen, 2015 Oct 04-07; Verhandlungen |
| Kasper,Laura; Alam Bhuiyan,Ifte Khairul; Adner,David; Kalbacova,Jana; Blaudeck,T.; Rodriguez,Raul D.; Hermann,S.; Zahn,Dietrich R.T.; Lang,Heinrich; Schulz,S.E.: Characterization of Gold-Decorated Carbon Nanotube Field-Effect Transistors in Planar Device Geometry. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Kasper,Laura; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Wafer-level fabrication and characterization of photosensitive CNT-FETs . DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Matthes,P.; Almeida,M.; Mueller,M.; Ebert.R.; Ecke,R.; Ueberschaer,O.; Exner,H.; Schulz,S.E.: Laser Induced Exchange Bias Realignment Enabling a Monolithic Integration of More Dimensional Magnetic Field Sensors. ILACOS - International Laser And Coating Symposium, Dresden (Germany), 2015 Oct 7; Proceedings |
| Matthes,P.; Almeida,M.; Ueberschaer,O.; Mueller,M.; Ebert,R.; Ecke,R.; Exner,H.; Schulz,S.E.: GMR based 2D magnetic field sensors. SEMNICON Europa, Dresden (Germany), 2015 Oct 6-8; Proceedings |
| Mehta,Ninad; Hille,Toni; Singh Thakur,Dheeraj; Sheremet,Evgeniya; Blaudeck,T.; Schulze,Steffen; Hermann,S.; Hietschold,Michael; Schulz,S.E.: Spectroscopic Monitoring and Data Evaluation of Carbon Nanotube Dispersion Preparation. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Mothes,R.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: [Ag{S2CNR(C2H4OH)}] as Single-Source Precursor for Ag2S – Synthesis, Decomposition Mechanism, and Deposition Studies. European Journal of Inorganic Chemistry, 2015, 10 (2015) p 1726–1733 |
| Pérez,N.; Melzer,M.; Makarov,D.; Ueberschaer,O.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.: High-performance GMR sensorics on flexible Si membranes. Applied Physics Letters, 106, 15 (2015) |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Ecke,R.; Mueller,M.; Exner,H.; Schulz,S.E.: Innovative 2D spin valve sensors in monolithic integration for high-sensitivity compass applications. 13th Symposium Magnetoresistive Sensors and Magnetic Systems, Wetzlar (Germany), 2015 Mar 3-4; Proceedings |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications. SPIE Optics + Photonics, San Diego (USA), 2015 Aug 9-13; Proceedings |
| Ueberschaer,O.; Almeida,M.J.; Matthes,P.; Mueller,M.; Ecke,R.; Rueckriem,R.; Schuster,J.; Exner,H.; Schulz,S.E.: Optimized Monolithic 2D Spin-Valve Sensor for High Sensitivity Compass Applications. IEEE Trans. Magn., 51 (2015) p 4002404 |
