Publikationen
2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Jahr 2024
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Braun,S.; Wiemer,M.; Schulz,S.E.: Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level. Micromachines, 15, 746 (2024) pp 1-18 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Fischer,T.; Helke,C.; Haase,M.; Hanisch,A.; Hofmann,L.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding. 10th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024 Sep 11-13; Proceedings, pp 1-5 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis. ECS Journal of Solid State Science and Technology, 13, 10 (2024) |
