| Bonitz,J.; Schulz,S.E.; Gessner,T.: CVD TiN layers as diffusion barrier films on porous SiO2 aerogel. Microelectronic Eng., 70 (2003) pp 330-336 |
| Buschnakowski,S.; Bertz,A.; Braeuer,W.; Heinz,S.; Schuberth,R.; Ebest,G.; Gessner,T.: Development and Characterization of a High Aspect Ratio Vertical FET Sensor for Motion Detection. The 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 03, Boston (USA), 2003 Jun 8-12 |
| Delan,A.; Rennau,M.; Schulz,S.E.; Gessner,T.: Thermal Conductivity of ultra low-k dielectrics. MAM, La Londe Les Maures (France), 2003 Mar 9-12; Microelectronic Eng., 70 (2003) pp 280-284 |
| Doering,L.; Brand,U.; Peiner,E.; Fruehauf,J.; Gaertner,E.: Development of micro force setting standards for stylus instruments. Proceedings of the EUSPEN, Aachen, p 407 |
| Ecke,R.; Hecker,M.; Schulz,S.E.; Engelmann,H.-J.; Gessner,T.; Mattern,N.; Zschech,E.: Properties of as-deposited and annealed PECVD Tungsten Nitride films. European Congress on Advanced Materials and Processes EUROMAT 2003, Lusanne (Switzerland), 2003 Sept. 1-5 |
| Ecke,R.; Schulz,S.E.; Gessner,T.; Riedel,S.; Lipp,E.; Eizenberg,M.: Deposition and treatment of titanium based barrier layers by MOCVD. Proc. Chemical Vapor Deposition XVI and EUROCVD 14, 2003-08 (2003) pp 1224-1230 |
| Ecke,R.; Schulz,S.E.; Hecker,M.; Mattern,N.; Gessner,T.: Influence of SiH4 on the WNx-PECVD process. MAM, La Londe Les Maures (France), 2003 Mar 9-12; Microelectronic Eng., 70 (2003) pp 346-351 |
| Emelianov,V.; Ganesan,G.; Puzic,A.; Schulz,S.E.; Eizenberg,M.; Habermeier,H.U.; Stoll,H.: Investigation of Electromigration in Copper Interconnects by Noise Measurements. SPIE Fluctuations and Noise, Santa Fe, New Mexico (USA), 2003 Jun 1–4; Proceedings SPIE, 5112 (2003) pp 271-281 |
| Flaspoehler,M.; Buschnakowski,S.; Kuhn,M.; Kaufmann,C.; Fruehauf,J.; Gessner,T.; Ebest,G.; Huebler,A.: Multispectral Image Capturing System Based on a Micro Mirror Device with a Diffraction Grating. PICS Conference - The Digital Photography Conference, Rochester, NY (USA); Proceedings , 6 (2003) pp 183-187 (ISBN 0-89208-245-3) |
| Fruehauf,S.; Streiter,I.; Puschmann,R.; Schulz,S.E.; Himcinschi,C.; Flannery,C.M.; Gessner,T.; Zahn,D.R.T.: Modified silica aerogel as a low-k dielectric with improved
mechanical properties. ULSI XVIII, 2003; Proceedings, pp 507-512 |
| Fruehauf,S.; Streiter,I.; Rennau,M.; Puschmann,R.; Schulz,S.E.; Gessner,T.; Chudoba,T.; Richter,F.,Flannery,C.; Matusche,J.; Schmidt.U.: Electrical and Mechanical characterization of porous silicon dioxide as an ultra low k dielectric. Proceedings of Materialsweek, Munich (Germany), 2003 Sept. 30th- Oct. 2nd |
| Gaertner,E.; Fruehauf,J.; Jaensch,E.; Reuter,D.: Flexural solid hinges etched from silicon. EUSPEN, p 43 |
| Geiger,W.; Breng,U.; Leinfelder,P.; Gutmann,W.; Ohmberger,R.; Kunz,J.; Ruf,M.; Huber,M.; Ryrko,B.; Hafen,M.; Spahlinger,G.; Schroeder,W.; Handrich,E.; Hiller,K.; Billep,D.: The micromechanical Coriolis Rate
Sensor µCORS II. Symposium Gyro Technology, Stuttgart (Germany), 2003 |
| Gessner,T.: Micro- and Nanotechnologies – Challenges for Microelectronics and MEMS. Portland Area Semiconductor Seminar Series, University of Portland, Oregon, USA,, 2003 October |
| Gessner,T.: Selected Challenges of Advanced Interconnect Systems. University of Albany- SUNY, Albany, New York (USA), 2003 October |
| Gessner,T.: MEMS and Microsystems Technologies. Summer School on Precision Assembly, Eindhoven (Netherlands), 2003 July |
| Gessner,T.: Werkstoff- und Technologieaspekte der Silizium-Mikromechanik für Anwendungen in der Automobilindustrie. Fachkongress MicroCar 2003, Leipzig, 2003 June 26 |
| Gessner,T.: Microsystems Technologies. |
| Gessner,T.; Bertz,A.; Lohmann,C.; Kurth,S.; Hiller,K.: Advanced Silicon Micromachining. International Journal of Computational Engineering Science, 4, Nr.2 (2003) pp 151-156 |
| Gottfried,K.; Kaufmann,C.; Hoffmann,R.; Wiemer,M.; Gessner,T.: Temperaturstabile Metallisierungs – und Anschlusssysteme für Sensoranwendungen im Kraftfahrzeug. Fachkongreß MicroCar 2003, Leipzig (Germany), 2003 June 26 |
| Hanf,M.; Kurth,S.; Billep,D.; Hahn,R.; Faust,W.; Heinz,S.; Doetzel,W.; Gessner,T.: Application of micro mirror arrays for Hadamard transform optics. 9th Int. Symp. on Microwave and Optical Technology (ISMOT2003),, Ostrava (Czech Republic), 2003 |
| Hecker,M.; Huebner,R.; Mattern,N.; Voss,A.; Acker,J.; Ecke,R.; Schulz,S.E.; Gessner,T.; Wenzel,C.; Bartha,J.; Engelmann,H.-J.; Zschech,E.: Effect of thermal
stressing on the microstructure of tungsten and tantalum based diffusion barrier layers. European Congress on Advanced Materials and Processes EUROMAT 2003, Lausanne (Switzerland), 2003 Sept. 1-5 |
| Heinz,S.; Buschnakowski,S.; Bertz,A.; Braeuer,W.; Korndoerfer,F.; Schuberth,R.; Zeun,H.; Ebest,G.; Gessner,T.: Vertikaler Feldeffekttransistor mit beweglicher Gate-Vertikaler Feldeffekttransistor mit beweglicher Gate-Elektrode für die Bewegungsdetektion. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 487-492 (ISBN 3-85133-030-7) |
| Heinz,S.; Buschnakowski,S.; Bertz,A.; Braeuer,W.; Schuberth,R.; Ebest,G.; Gessner,T.: Vertikaler Feldeffekttransistor mit beweglicher Gate-Elektrode für die Bewegungsdetektion. 6. Chemnitzer Fachtagung Mikromechanik und Mikroelektronik, Chemnitz (Germany), 2003 Oct. 29-30 |
| Heinz,S.; Buschnakowski,S.; Bertz,A.; Braeuer,W.; Schuberth,R.; Ebest,G.; Gessner,T.: A High Aspect Ratio Vertical FET Sensor for Motion Detection. MICRO SYSTEM Technologies 2003, Posterpräsentation, Munich (Germany), 2003 Oct. 7-8 |
| Heinz,S.; Buschnakowski,S.; Korndoerfer,F.; Zeun,H.; Hiller,K.; Hahn,R.; Ebest,G.: Integrierter 48-kanaliger Hochvolt-Schalter zur Ansteuerung mikromechanischer Schwenkspiegel. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 493-498 (ISBN 3-85133-030-7) |
| Hiller,K.; Hahn,R.; Kaufmann,C.; Hanf,M.; Heinz,S.; Gessner,T.; Doetzel,W.; Ebest,G.: Technologieentwicklung für ein Mikrospiegelarray mit integrierter Elektronik. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct. 29.30; Proceedings, pp 54-59 |
| Hiller,K.; Kurth,S.; Neumann,N.; Hahn,R.; Kaufmann,C.; Hanf,M.; Heinz,S.; Gessner,T.; Doetzel,W.; Ebest,G.: Application of low temperature direct bonding in
optical devices and integrated systems. Proceedings of MICRO SYTEM Technologies 2003; Proceedings , pp 102-109 |
| Himcinschi,C.; Friedrich,M.; Fruehauf,S.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.: Contributions to static dielectric constants of low-k xerogels films derived from VASE and IR spectroscopies. International Conference on Spectroscopic Ellipsometry, Vienna (Austria), 2003 July 6 - 11 |
| Koenig,D.; Zahn,D.R.T.; Reich,R,; Gottfried,K.; Ebest,G.: P inversion layer solar
cells as test for the I-S structure: results and prospects. 3rd World Conference on PV Solar Energy Conversion, Osaka (Japan), 2003 may 11-18 |
| Kotarsky,U.; Manthey,W.; Dietzsch,M.; Bertz,A.: „Hochauflösender mikromechanischer
Sensor zur Erfassung von Oberflächenprofilen mit großem Eigenzustellbereich. 6.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30 |
| Kuhn,M.; Flaspoehler,M.; Kroenert,S.; Kaufmann,C.; Gessner,T.; Huebler,A.; Fruehauf,J.: Herstellung und Charakterisierung von mikromechanischen Scannern mit
intergrierten Beugungsgittern. 6. Chemnitzer Fachtagung Mikrosystemtechnik-
Mikromechanik & Mikroelektronik, 2003, Chemnitz (Germany), 2003 |
| Kuhn,M.; Flaspoehler,M.; Kroenert,S.; Kaufmann,C.; Gessner,T.; Huebler,A.; Fruehauf,J.: Microactuators with Diffraction Grating. Micro Systems Technologies 2003, Postersession, Munich (Germany), 2003 Oct 7-8 |
| Kurth,S.,; Hiller,K.; Doetzel,W.; Gessner,T.; Neumann,N.; Heinze,M.: Tunable
infrared filter based on Fabry-Perot-Interferometer. Proc. of Micro System Technologies 2003, Munich (Germany), 2003 Oct 7-8 |
| Kurth,S.,; Hiller,K.; Neumann,N.; Heinze,M.; Doetzel,W.; Gessner,T.: An electrically tunable infrared filter on base of Fabry-Perot-Interferometer. 9th International Symposium
on Microwave and Optical Technology, ISMOT, Ostrava (Czech Republic), 2003 August 11-15 |
| Kurth,S.,; Hiller,K.; Neumann,N.; Heinze,M.; Doetzel,W.; Gessner,T.: A tunable Fabry-Perot-Interferometer for 3 – 4.5 µm wavelength with bulk micromachined reflector carrier. SPIE Conference Photonics West, 2003 January; Proceedings, 4983 (2003) pp 215-226 |
| Lang,H.; Leschke,M.; Melter,M.; Walfort,B.; Koehler,K.; Schulz,S.E.; Gessner,T.: Ein- und zweikernige Kupfer(I)- und Silber(I)-Phosphan-Komplexe mit b-Diketonato-Teilstrukturen
. Z. anorg. allg. Chemie, 629 (2003) p 2371 – 2380 |
| Lohmann,C.; Bertz,A.; Kuechler,M.; Gessner,T.: Mechanical reliability of MEMS
fabricatedby a special technology using standard silicon wafers. SPIE Conference 4980, San Jose (USA), January 2003 |
| Mueller,A.-D.; Mueller,F.; Mehner,J.; Wibbeler,J.; Gessner,T.; Hietschold,M.: Electrostatic double-cantilever device for dynamic noncontact-mode Atomic Force Microscopy. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30 |
| Neumann,N.; Heinze,M.; Stegbauer,H.-J.; Hiller,K.; Kurth,S.: mikromechanisches, durchstimmbares Fabry-Perot-Filter für die nichtdispersive Gasanalytik
im Spektralbereich (3…5) µm. 6. Dresdner Sensor-Symposium 2003 |
| Reuter,D.; Froemel,J.; Schwenzer,G.; Bertz,A.; Gessner,T.: Selektives Niedertemperaturbonden mit SU-8 fuer Wafer-Level-Verkappung von mikromechanischen
Strukturen. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2003 Oct 29-30 |
| Reuter,D.; Froemel,J.; Schwenzer,G.; Bertz,A.; Gessner,T.: Selektives
Niedertemperaturbonden mit SU-8 fuer Wafer-Level-Verkappung von mikromechanischen
Strukturen. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30 |
| Rinderknecht,J.; Prinz,H.; Kammler,T.; Schell,N.; Zschech,E.; Wetzig,K.; Gessner,T.: In situ high temperature synchrotron-radiation diffraction studies of silicidation
processes in nanoscale Ni layers. MAM 2003, La Londe Les Maures (France), 2003 Mar 9-12; Proceedings, Microelectronic Engn., 70 (2003) pp 226-232 |
| Scheibner,D.; Mehner,J.; Braemer,B.; Gessner,T.; Doetzel,W.: Wide Range Tunable
Resonators for Vibration Measurements. Microelectronic Engineering 67-68, 2003; Proceedings, pp 542-549 |
| Scheibner,D.; Mehner,J.; Reuter,D.; Gessner,T.; Doetzel,W.: Tunable Resonators with
Electrostatic Self Test Functionality for Frequency Selective Vibration Measurements. MEMS 2003, Kyoto (Japan); Proceedings, pp 526-529 |
| Scheibner,D.; Mehner,J.; Reuter,D.; Kotarsky,U.; Gessner,T.; Doetzel,W.: CHARACTERIZATION AND SELF TEST OF ELECTROSTATICALLY TUNABLE
RESONATORS FOR FREQUENCY SELECTIVE VIBRATION MEASUREMENTS. Sensors and Actuators 2003 |
| Scheibner,D.; Wibbeler,J.; Mehner,J.; Braemer,B.; Gessner,T.; Doetzel,W.: A
Frequency Selective Silicon Vibration Sensor with Direct Electrostatic Stiffness Modulation. Analog Integrated Circuits and Signal Processing,, 2003; Proceedings, pp 35-43 |
| Schulz,S.E.; Aubel,O.; Baumann,J.; Hasse,W.; Gessner,T.: Copper Alloys for
Improved Interconnect Properties. (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23 |
| Schulz,S.E.; Blaschta,F.; Eisener,B.; Fruehauf,S.; Schulze,K.; Seidel,U.; Koerner,H.; Gessner,T.: SiO2-Aerogel ULK Integration into Copper Damascene Interconnects for RF Devices. AMC (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23 |
| Schulz,S.E.; Schulze,K.; Matusche,J.; Schmidt,U.; Gessner,T.: Effect of PECVD SiC
and SiCN cap layer deposition on mesoporous silica ultra low k dielectric films. 14th Annual IEEE/SEMI Advanced Semiconductor Manufacturing
Conference and Workshop, Munich (Germany), 2003 Mar 31- April 1 |
| Sternberger,A.; Hiller,K.; Gessner,T.; Doetzel,W.; Kurth,S.; Neumann,N.; Heinze,M.: Closed loop controll of a tunable infrared filter. Int. Conf. on Applied Electronics 2003, Pilsen (Czech Republic), 2003 Sept 10-11; Proceedings , pp 197-200 |
| Uhlig,M.; Bertz,A.; Brocke,H.; Dobler,M.; Flannery,C.; Jnawali,G.; Zeidler,D.; Gessner,T.: Integration of Plasma Deposited CF Polymer in a Copper / Low k Damascene
Architecture”,. ULSI XVIII; Materials Research Society, Warrendale , pp 629-635 |
| Uhlig,M.; Bertz,A.; Erben,J.-W.; Schulz,S.E.; Gessner,T.; Zeidler,D.; Wenzel,C.; Bartha,J.: Experimental results on the integration of copper and CVD ultra low k
material. MAM 2003, La Londe Les Maures (France), 2003 Mar 9-12; Proceedings,
Microelectronic Eng., 70 (2003) pp 314-319 |
| Wenger,Ch.; Huebner,R.; Wenzel,Ch.; Reinicke,M.; Hecker,M.; Mattern,N.; Wetzig,K.; Baumann,J.; Schulz,S.; Bartha,J.W.; Engelmann,H.-J.; Zschech,E.: Stability of
graded Ta-TaN-Ta and single layer TaSiN diffusion barriers for copper interconnect
systems. ULSI XVIII; Materials Research Society, Warrendale (2003),, pp 847-851 |
| Wiemer,M.; Froemel,J.; Gessner,T.: Trends der Technologieentwicklung im Bereich Waferbonden. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelelektronik, Chemnitz (Germany), 2003 Oct 29-30; Proceedings, p 178 |
| Wiemer,M.; Froemel,J.; Gessner,T.; Nowak,B.; Suedkamp,W.; Peschka,A.; Bagdahn,J.; Petzold,M.: Bewertung von Niedertemperaturbondverfahren für Drucksensoren in der Automobiltechnik. MicroCar 2003, Leipzig, 2003 Jun 26 |
| Wiemer,M.; Froemel,J.; Jia,C.; Gessner,T.: Bonding and contacting of MEMS-structures on wafer level. The Electrochemical Society - 203 rd meeting, Paris, 2003 May 2; Proceedings |
| Windhorn,K.; Meixner,L; Drost,S.; Schroeder,H.; Kilgus,E.; Scheel,W.; Ebling,F; Otto,T.; Kuechler,M.; Nestler,J.; Gessner,T.: Polymer BioMEMs with integrated optical and fluidic functionality. Micro System Technologies, Munich (Germany), 2003 Oct 7-8; Proceedings, pp 416-423 |
| Zhou,J.; Baum,M.; Schmiedel,R.; Huang,Y.; Ruan,G.; Gessner,T.: Harmonic Analysis of Microbeams with PZT on-Chip Actuating and Sensing. EMF, Cambridge (UK), 2003 Aug 3-8; Journal of Conference, Abstracts, 8 (2003) p 376 (ISSN 1362-0886) |
| Zimmermann,S.; Baumann,J.; Kaufmann,C.; Gessner,T.: Thermal stability of thin Ta and TaNx films as diffusion barriers for copper metallization. ULSI XVIII, 2003; Materials Research Society, Warrendale (2003), pp 859-864 |
| Zimmermann,S.; Ecke,R.; Rennau,M.; Schulz,S.E.; Hecker,M.; Voss,A.; Engelmann,H.-J.; Acker,J.; Mattern,N.; Zschech,E.; Gessner,T.: Characterisation of a PECVD WNx Barrier Layer Against Copper Diffusion. AMC (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23 |
