| Baum,M.; Haubold,M.; Besser,J.; Wiemer,M.; Gessner,T.: Biocompatibility evaluation of MEMS packaging materials for implantable devices. BMT 2013 Dreiländertagung der Deutschen, Schweizerischen und Österreichischen Gesellschaft für Biomedizinische Technik , Graz (Austria), 2013 Sept 19-21; Abstraktband, pp 573-574 |
| Baum,M.; Hofmann,L.; Wiemer,M.; Schulz,S.E.; Gessner,T.: Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding. Semiconductor Conference Dresden-Grenoble (ISCDG), Dresden, 2013 Sep 26-27; Proceedings (ISBN 978-1-4799-1250-6) |
| Dhakal,D.; Waechtler,T.; Melzer,M.; Mothes,R.; Schulz,S.E.; Lang,H.; Gessner,T.: In-situ XPS investigation of the surface chemistry of a Cu(I) Beta-Diketonate precursor with reference to the ALD of Cu2O. 17. Tagung Festkörperanalytik (FKA 17), Chemnitz (Deutschland), 2013 Jul 1-3 |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Electrical properties of Carbon Nanotube Interconnects. MAM, Leuven (Belgium), 2013 Mar 10-13; Poster |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Preparation and Characterization of Carbon Nanotubes based Via Interconnects. INC 9, Berlin(Germany), 2013 May 14-17; Poster |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Evegniya,S.; Rennau,M.; Schulze,S.; Waechtler,T.; Zahn,D.R.T.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Low resistance carbon nanotube - metal contact for interconnect applications. NT, Helsinki(Finland), 2013 Jun 24-28; Poster |
| Foerster,A.; Wagner,C.; Schuster,J.; Friedrich,J.: Ab-initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes. 49th Symposium on Theoretical Chemistry 2013, Erlangen (Germany), 2013 Sep 22-26; Poster; |
| Fuchs,F.; Wagner,C.; Schuster,J.: Ab-initio study of metal-decorated carbon nanotubes for interconnect and sensor applications. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Poster; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Haas,S.; Schramm,M.; Reuter,D.; Loebel,K.-U.; Bertz,A.; Horstmann,J.T.; Gessner,T.: Direct Integration of Field Effect Transistors as Electro Mechanical Transducer for Stress. The 7th International Conference on Sensing Technology, Wellington (New Zealand), 2013 Dec 3-5; Proceedings, pp 379-382 (ISBN 978-1-4673-5220-8 ) |
| Haubold,M.; Baum,M.; Wiemer,M.; Gessner,T.: Integrated Smart Systems for theranostic Applications. Dreiländertagung der Deutschen, Schweizerischen und Österreichischen Gesellschaft für Biomedizinische Technik , Graz (Austria), 2013 Sept 19-21 |
| Helke,C.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Harazim,S.M.; Schmidt,O.G.; Otto,T.; Gessner,T.: Integration of rolled-up nanomembranes by means of MEMS- and Lasertechnology. MikroSystemTechnik Kongress 2013, Aachen, 2013 Oct 14-16; Proceedings, pp 837-840 (ISBN ISBN 978-3-8007-3555-6) |
| Hiller,K.; Hahn,S.; Kuechler,M.; Billep,D.; Forke,R.; Koehler,D.; Konietzka,S.; Pohle,A.; Gessner,T.: Erweiterungen und Anwendungen der BDRIE-Technologie zur Herstellung hermetisch gekapselter Sensoren mit hoher Güte. Mikrosystemtechnik-Kongress 2013, Aachen (Germany), 2013 Okt 14-16; Proceedings, pp 299-302 (ISBN 978-3-8007-3555-6) |
| Hofmann,L.; Baum,M.; Schulz,S.E.; Wiemer,M.; Gessner,T.: 3D Integration Technologies for MEMS based on Copper TSVs and Copper-to-Copper Metal Thermo Compression Bonding. Advanced metallization conference 2013, Albany, 2013 Oct 21-23; Talk |
| Hofmann,L.; Baum,M.; Schulz,S.E.; Wiemer,M.; Gessner,T.: 3D technologies for integration of MEMS
. SEMICON Europa , Dresden, Oct 8-10; Talk |
| Hofmann,L.; Schubert,I.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Gessner,T.: Vertical Integration techniques for MEMS using HAR TSV. Smart Systems Integration, Amsterdam(NL), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Kuechler,M.: Erfahrungen beim Ätzen großer Flächen. 3. Workshop "Tiefes Siliziumätzen", Ilmenau, TU Ilmenau, Zentrum für Mikro- und Nanotechnologien, 2013 Sep 04 |
| Lin,Y.-C.; Gabler,F.; Tanaka,S.; Esashi,M.; Gessner,T.: Design and simulation of nanomaterial-enhanced LTCC integrated inductors. Smart Systems Integration Conference 2013, Amsterdam (The Netherlands), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Lin,Y.-C.; Gabler,F.; Tsai,Y.-C.; Tanaka,S.; Gessner,T.; Esashi,M.: LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF system. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Barcelona (Spain), 2013 Jun 16-20; Proceedings, pp 1404-1407 |
| Luo,J.; Billep,D.; Waechtler,T.; Otto,T.; Toader,M.; Gordan,O.; Sheremet,E.; Martin,J.; Hietschold,M.; Zahn,D.R.T.; Gessner,T.: Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment. J. Mater. Chem. A, 1, 26 (2013) pp 7576-7583 (ISSN 2050-7488) |
| Luo,J; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: Investigation of multiwall carbon nanotube and DMSO on the thermoelectric performance of PEDOT:PSS thin films. Smart System Integration Conference, Amsterdam (The Netherland), 2013 Mar 13-14 |
| Meinecke,C.; Hofmann,L.; Bertz,A.; Gottfried,K.; Gessner,T.: Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung. Mikrosystemtechnik-Kongress, Aachen, 2013 Oct 14-16; Proceedings (ISBN 978-3-8007-3555-6 ) |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Zahn,D.R.T.; Hietschold,M.; Lang,H.; Gessner,T.: Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications. Microelectron. Eng., 107 (2013) pp 223-228 (ISSN 0167-9317) |
| Moebius,M.; Martin,J.; Weiss,A.; Spudat,C.; Otto,T.; Gessner,T.; Halder,S.; Hummel,D.: System zum Messen einer Axialkraft einer Schraubverbindung. DE102013107671A1 |
| Nestler,J.; Enderlein,T.; Geidel,S.; Gessner,T.: Mikrofluidikvorrichtung und Verfahren zur Herstellung einer Mikrofluidikvorrichtung. Patentanmeldung (DE 10 2013 100 075) |
| Otto,T.; Gessner,T.; Nestler,J.: Zweckentfremdete Leiterplatten: Das Labor afu dem Chip, Vollintegrierter Transport von kleinen Flüssigkeitsmengen für integrierte biochemische Nachweisverfahren. PLUS Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik, 2 (2013) (ISSN 1436-7505) |
| Radons,G.; Zienert,A.: Nonlinear dynamics of complex hysteretic systems: Oscillator in a magnetic field. Eur. Phys. J. Spec. Top., 222, 7 (2013) pp 1675-1684 (ISSN 1951-6355) |
| Reuter,D.; Banerjee,S.; Fronk,M.; Salvan,G.; Hiller,K.; Zahn,D.R.T.; Gessner,T.: Laterally stacked organic devices fabricated by trench technology. Smart Systems Integration, Amsterdam (NL), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Richter,P.; Banerjee,S.; Schulze,C.; Reuter,D.; Hiller,K.; Albrecht,M.; Zahn,D.R.T.; Salvan,G.: Magneto-optical characterization of organic/inorganic heterostructures for lateral spintronic devices. 10th International Conference on Optics of Surfaces and Interfaces (OSI-10), Chemnitz, 2013 Sep 08-13 |
| Salvan,G.; Robaschik,P.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Thomas,S.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures. Microelectron. Eng., 107 (2013) pp 130-133 (ISSN 0167-9317) |
| Schulze,R.; Heinrich,M.; Wegener,M.; Forke,R.; Billep,D.; Gessner,T.: Piezoelectric Accelerometer Based on Micro Injection Molded Polymers. Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS EUROSENSORS XXVII), 2013 Transducers Eurosensors XXVII: The 17th International Conference on, Barcelona (Spain), 2013 Jun 16-20; Proceedings, pp 35-38 |
| Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. Microelectronic Eng., 107 (2013) pp 161-166 |
| Shaporin,A.; Hermann,S.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.; Bonitz,J.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Smart Systems Integration Conference 2013 (SSI), Amsterdam (The Netherlands), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Stoeckel,C.; Hofmann,K.; Forke,R.; Billep,D.; Gessner,T.: Optimization of MEMS/NEMS for reliable resonance frequencies. Smart Systems Integration, Amsterdam (The Netherlands), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Stoeckel,C.; Kaufmann,C.; Schulze,R.; Billep,D.; Gessner,T.: Precise determination of piezoelectric longitudinal
charge coefficients for piezoelectric thin films
assisted by finite element modeling. UFFC, Prag, 2013 Jul 21-25 |
| Teichert,F.; Zienert,A.; Schuster,J.: Electronic structure and transport properties of crossed carbon nanotubes. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Poster presentation; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Tittmann,J.; Hermann,S.; Fiedler,H.; Schulz,S.E.; Gessner,T.: Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs. NT13, Fourteenth International Conference on the Science and Application of Nanotubes, Aalto University, Helsinki (Finland), June 24-28; Proceedings, p 76 |
| Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.: Conductive AFM for CNT characterization. Nanoscale Research Letters, 8, 1 (2013) p 24 |
| Tsai,Y.-C.; Lee,J.-W.; Naono,T.; Lin,Y.-C.; Esashi,M.; Fujii,T.; Gessner,T.: Metallic glass micro-mirror integrated with PZT actuation for low resonant frequency and large exciting angle. International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Barcelona (Spain), 2013 Jun 16-20; Proceedings, pp 2493-2496 |
| Tsai,Y.-C.; Lee,J.-W.; Naono,T.; Lin,Y.-C.; Esashi,M.; Fujii,T.; Gessner,T.: Integration and fabrication of PZT and metallic glass films for micro-mirror device. Smart Systems Integration Conference 2013, Amsterdam (The Netherlands), 2013 Mar 13-14; Proceedings (ISBN 978-3-8007-3490-0) |
| Ueberfuhr,P.; Grossmann,T.D.; Gaitzsch,M.; Kurth,S.; Baumann,R.R.: Printing of GHz antenna pattern on flexible substrates for the manufacturing of intelligent light-weight structures. The 40th International research conference of iarigai (The International Association of Research Organizations for the Information, Media and Graphic Arts Industries): Advances in Printing And Media Technology: Digitalization of Print, Chemnitz (Germany); Proceedings |
| Ueberfuhr,P.; Siegel,F.; Grossmann,T.; Gaitzsch,M.; Kurth,S.; Baumann,R.R.: Printing of GHz antenna pattern on flexible substrates for the manufacturing of intelligent light-weight structures. Advances in Printing and Media Technology, Chemnitz, Sept. 2013; Proceedings of the 40th Int. Research Conference of iarigai, pp 69-80 (ISBN 978-3-9812704-4-0) |
| Waechtler,T.; Dhakal,D.; Melzer,M.; Sharma,A.; Gummenscheimer,A.; Ahner,N.; Hermann,S.; Fiedler,H.; Schulz,S.E.; Gessner,T.: ALD of Transition Metals and Metal Oxides for Applications in Electronics and Sensor Devices. Symposium of the ALD Lab Dresden @ SEMICON Europa 2013, Dresden (Germany), 2013 Oct 8 |
| Waechtler,T.; Sharma,A.; Ahner,N.; Melzer,M.; Mueller,S.; Gummenscheimer,A.; Lehmann,D.; Schaefer,P.; Schulze,S.; Schulz,S.E.; Zahn,D.R.T.; Hietschold,M.; Gessner,T.: ALD of Nickel Oxide and Its Reduction to Nickel for Potential Applications in Interconnects and Spintronics. AVS 13th International Conference on Atomic Layer Deposition (ALD 2013), San Diego, CA (USA), 2013 Jul 29-31 |
| Wagner,C.; Fuchs,F.; Schuster,J.; Gessner,T.: Theoretical investigations of an acceleration sensor based on a carbon nanotube transistor. International Conference on Diamond and Carbon Materials, Riva del Garda, Italy, 2013 Sep 2-4; Poster presentation |
| Wagner,C.; Fuchs,F.; Teichert,F.; Schuster,J.; Gessner,T.: Theoretical investigation of CNT transistors used as strain sensors. IWEPNM, Kirchberg in Tirol (Austria), 2013 Mar 2-9; Poster presentation |
| Wagner,C.; Schuster,J.; Gessner,T.: Analytical and numerical transistor models for Carbon nanotubes under strain. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Zienert,A.; Schuster,J.; Gessner,T.: Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes. Microelectron. Eng., 106 (2013) pp 100-105 |
| Zienert,A.; Schuster,J.; Gessner,T.: Extended Hückel Theory for Carbon Nanotubes: Band Structure and Transport Properties. J. Phys. Chem. A, 117 (2013) pp 3650-3654 |
| Zienert,A.; Schuster,J.; Gessner,T.: Electronic transport properties of metallic carbon
nanotubes with metal contacts. IWEPNM 2013, Kirchberg in Tirol (Austria), 2013 Mar 2-9; Poster presentation |
| Zienert,A.; Schuster,J.; Gessner,T.: Electron transport properties of metallic carbon nanotubes with metal contacts. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Zienert,A.; Schuster,J.; Gessner,T.: Electronic transport properties of metallic carbon nanotubes with metal contacts: size effects and contact resistance. NT13: The Fourteenth International Conference on the Science and Application of Nanotubes, Espoo (Finland), 2013 Jun 24-28; Poster presentation |
| Zienert,A.; Schuster,J.; Gessner,T.: Extended Hückel theory for electronic transport in carbon nanotubes with metal contacts. CCTN13: Eighth International Symposium on Computational Challenges and Tools for Nanotubes, Tallinn (Estonia), 2013 Jun 29-30; Talk |
