Publikationen
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Jahr 2023
| Di Nuzzo,G; Lewitschnig,H.; Tuellmann,M.; Rzepka,S.; Otto,A.: A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters. IEEE International Conference on Prognostics and Health Management ICPHM 2023, Montreal (Canada), 2023 Jun 5-7; Proceedings (ISBN 979-8-3503-4625-1, 979-8-3503-4626-8, 2166-5656, 2166-563X) |
| Doering,R.; Dudek,R.; Rzepka,S.; Scheiter,L.; Noack,E.; Seiler,B.: Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies. Journal of Electronic Packaging, ASME, March 2023, 145, 1 (2023) p 011107 (6 pages) (ISBN 1528-9044, 1043-7398) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Kinner,R.; Suroshe,R.; Kuechler,M.; Stephan,R.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 2023 Dec 5-8; IEEE Xplore, pp 469-473 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Hanisch,A.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Schulz,S.E.; Ghosal,S.; Hofmann,L.: Process and Design Challenges for Hybrid Bonding. ESC Transaction, 112, 3 (2023) pp 73-81 |
| Dudek,R.; Otto,A.; Doering,R.; Mathew,A.; Rzepka,S.: Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling. 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2023, Graz (Austria), 2023 Apr 16-19; Proceedings (ISBN 979-8-3503-4597-1, 979-8-3503-4598-8, 2833-8596, 2833-8553) |
| Fitz,V.; Roscher,F.; Krause,F.; Baum,M.; Wiemer,M.; Kuhn,H.: Active wound patch with electrical stimulation. 57th Annual Meeting of the German Society of Biomedical Engineering (BMT), Duisburg, 2023 Sep 26-28; Proceedings of Abstracts, 68, s1 (2023) p 97 |
| Franz,M.; Safian Jouzdani,M.; Kassner,L.; Daniel,M.; Stahr,F.; Schulz,S.E.: Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor. Beilstein Journal of Nanotechnology, 14 (2023) pp 951-963 (ISSN 2190-4286) |
| Helke,C.; Behl,C.; Behlert,R.; Hartmann,S.; Haase,M.; Martin,J.; Reuter,D.; Hiller,K.: Al-SWG reflectors for tuneable VIS filters and spectroscopy applications . Micro and Nano Engineering Conference (MNE) 2023, Berlin, 25.09.-28.09.2023 |
| Helke,C.; Canpolat-Schmidt,C.H.; Heldt,G.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: "Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit" . Micro and Nano Engineering , 100189, 19 (2023) pp 1-6 (ISBN ISSN 2590-0072) |
| Helke,C.; Reinhardt,M.; Arnold,M.; Schwenzer,G.; Haase,M.; Wachs,M.; Gossler,C.; Goetz,J.; Keppeler,D.; Wolf,B.; Schaeper,J.; Salditt,Tm; Moser,T.; Schwarz,U.T.; Reuter,D.: On the Fabrication and Characterization of Polymer-Based Waveguide Probes for Use in Future Optical Cochlear Implants. Materials, 16, 1 (2023) pp 1-17 |
| Helke,C.; Seiler,J.; Meinig,M.; Grossmann,T.; Werner,T.; Bonitz,J.; Haase,M.; Zimmermann,S.; Ebermann,M.; Kurth,S.; Reuter,D.; Hiller,K.: INTEGRATION OF (POLY-SILICON/AIR)N DISTRIBUTED BRAGG REFLECTORS IN A 150 MM BULK MICROMACHINED WAFER-LEVEL MOEMS FABRICATION PROCESS FOR THE USAGE IN IR-SPECTROMETRY . Transducers 2023 - The 22nd International Conference on Solid-State Sensors, Actuators and Microsysteme, Kyoto, 25.06.-29.06.2023; Proceedings , pp 1-4 |
| Hoffmann,M.; Schmitt,P.; Wittemeier,S.; Schaller,F.; Shaporin,A.; Stoeckel,C.; Geneis,V.; Forke,R.; Hedayat,C.; Hilleringmann,U.; Kuhn,H.; Zimmermann,S.: Storing MEMS Interfaces Without Electrical Auxiliary Energy for Long-Time Monitoring. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Munich (Germany), 2023 Jan 15-19; Proceedings, pp 522-525 (ISBN 978-1-6654-9308-6, 978-1-6654-9309-3, 2160-1968, 1084-6999) |
| Hofmann,C.; Kroll,M.; Hiller,K.: Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik. Schweissen und Schneiden, 8 (2023) pp 554 - 561 |
| Hofmann,C.; Rochala,P.; Kroll,M.; Panhale,S.; Baum,M.; Kuhn,H.; Oi,K.; Sanada,M.; Murayama,K.: Inductive sintering module for improved multi-die attach in the field of power packaging. 12th IEEE CPMT Symposium Japan (ICSJ2023), Kyoto (Japan), 2023 Nov 15-17; Proceedings, Session 13: Process and Material Technologies II (2023) |
| Kolas,K.; Rzepka,S.; Moeller,H.: Development of parametrized FE models with a geometry-based approach for Power Electronics Applications. NAFEMS World Congress 2023, Tampa (USA), 2023 May 15-18; Proceedings/Talk |
| Kuenzel,P.; Forke,R.; Hiller,K.; Schwarz,U.; Ziegenhardt,R.; Voigt,S.; Weidlich,S.; Shaporin,A.; Hahn,S.; Kuechler,M.; Kuhn,H.: Technologien mit hohem Aspektverhältnis für Vibrationssensoren mit großer Bandbreite, hoher Empfindlichkeit und geringem Rauschen. Mikrosystemtechnik Kongress, Dresden (Germany), 2023 Okt 23-25; Proceedings, pp 797-801 (ISBN ISBN 978-3-8007-6203-3) |
| Kunze,K.; Gossler,C.; Reinhardt,M.; Arnold,M.; Schwenzer,F.; Helke,C.; Reuter,D.; Keppeler,D.; Moser,T.; Schwarz,U.T.: Multichannel laser diode to polymer waveguide array coupling with a double-aspheric lens . Applied Optics , 62, 35 (2023) pp 9353-9360 |
| Lange,S.; Hedayat,C.; Foerstner,J.; Hilleringman,U.; Kuhn,H.: Characterization of Various Environmental Influences on the Inductive Localization. 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa (Italy), 2023 Nov 15-17; Proceedings (ISBN 979-8-3503-2304-7, 979-8-3503-2305-4, 2643-6795, 2474-1760) |
| Mathew,A.; Moeller,H.; Albrecht,J.; Rzepka,S.: Assessment of reliability issues in a microelectronics device by a simulation-driven sensitivity study. NAFEMS World Congress 2023, Tampa (USA), 2023 May 15-18; Proceedings/Talk |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a microelectromechanical system. DPG-Frühjahrstagung 2023 der Sektion Materie und Kosmos (SMuK), Dresden, Germany, 2023 Mar 20-24 |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Measurement of the ion angle distribution function in low-pressure plasmas using a microelectromechanical system. plasma etch and strip in microtechnology - PESM2023, Grenoble, France, 2023 June 19-20; Proceedings |
| Moeller,H.; Knoll,H.; Hille,P.; Rzepka,S.: Simulation driven investigation of production related thermo-mechanical effects for the behavior of a SO16-System-in-Package sensor. International Conference and Exhibition on Smart Systems Integration (SSI) 2023, Bruges (Belgium), 2023 Mar 28-30; Poster, Proceedings of the Smart Systems Integration Conference and exhibition, Conference Record Number: 58917, pp 181-183 (ISBN 979-8-3503-0231-8) |
| Nitsch,V.; Ng,WJ.; Brandstaetter,W.; Baum,M.; Rothe,T.; Sayyed,MA.; Langer,J.; Kaltschmidt,R.; Kuhn,H.: Parameter evaluation and image data analysis for the development of medical diagnostic Multi-Energy X-ray. 57th Annual Meeting of the German Society of Biomedical Engineering (BMT), Duisburg, 2023 Sep 26-28; Proceedings of Abstracts, 68, s1 (2023) p 162 |
| Otto,A.; Liu,X.; Eichhorn,R.; Basler,T.; Lutz,J.; Rzepka,S.: Study of Power Cycling Tests Superimposed with Passive Thermal Cycles on IGBT Modules. PCIM Europe 2023, Nürnberg (Germany), 2023 May 9-11; Proceedings, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (ISBN 978-3-8007-6091-6) |
| Reinhardt,M.; Helke,C.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: Development of an e-beam/i-line stepper intra-level mix and match approach with the photoresist mr-EBL 6000.5 for PIC related structures such as waveguides, ring resonators and coupling structures . 38th European Mask and Lithography Conference (EMLC 2023), Dresden, 19.-21.06.2023; Proceedings of SPIE , 12802 (2023) p 8 |
| Rodemund,T.; Teichert,F.; Hentschel,M.; Schuster,J.: Quantum transport in graphene nanoribbon networks: complexity reduction by a network decimation algorithm. New Journal of Physics, 25 (2023) p 013001 |
| Schroeder,D.; Hedayat,C.; Goelden,F.; Kuhn,H.: Broadband Far-Field Estimation of a Spherical Dipole using Near-Field Scanning Data up to 1 GHz. 2023 International Conference and Exhibition on Smart Systems Integration (SSI), IEEE, Bruges (Belgium), 2023 Mar 28-30; Proceedings of the Smart Systems Integration Conference and exhibition, Conference Record Number: 58917, pp 152-156 (ISBN 979-8-3503-0231-8, 979-8-3503-2506-5) |
| Sendel,M; Biller,H.; Gerngross,M.; Schirmer,M.; Langheinrich,D.; Hartmann,S.; Heldt,G.; Helke,C.: Optimizations on the conductive electron beam coating Electra 92 and the HSQ-alternative Medusa 82 . The 66th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication, San Francisco, 30.05.-02.06.2023 pp 1-2 |
| Wecker,J.; Hiller,K.; Grossmann,T.; Hahn,S.; Kurth,S.; Helke,C.; Kuechler,M.; Reuter,D.; Martin,J.; Weiss,A.; Kuhn,H.: Tunable Fabry-Pérot interferometer integrated in a silicon waveguide of an on-chip optical platform for long infrared wavelengths . Photonics West, San Francisco, 28.01.-02.02.2023; Proceedings of SPIE , 12426 (2023) pp 1-16 |
| Zienert,A.; Langer,J.; Rothe,T.; Wachner,D.; Hofmann,L.; Gottfried,K.: Automatic Analysis of CMP Dishing in Via Arrays from AFM Images. European CMP & WET Users Group Meeting, Buchs (Switzerland), 2023 Apr 20-21; Oral Presentation |
| Zienert,A.; Langer,J.; Wachner,D.; Hofmann,L.; Gottfried,K.; Schuster,J.: Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023 May 22-25; Proceedings, pp 1-3 |
| Zienert,A.; Langer,J.; Wachner,D.; Hofmann,L.; Gottfried,K.; Schuster,J.: Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023 May 22-25; Oral presentation |
