Publikationen
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Jahr 2006
| Baum,M.; Hientzsch,M.; Schaufuss,J.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Gelenkprothese und Verfahren zum Messen einer Abnutzung in dieser Gelenkprothese. Patentanmeldung & Offenlegungsschrift (DE102006051173 A1) |
| Bonitz,J.; Kaufmann,C.; Mehner,J.; Bleul,K.; Keiper,B.; Haenel,J.: Laser Trimming of Silicon Micro Mirror Devices. International Symposium on Laser-Micromachinig, Chemnitz, 2006 Sept 13-14 |
| Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures (poster). Advanced Metallization Conference (AMC), San Diego (USA), 2006 Oct 17-19 |
| Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Micromachined Force Coupled Sensor–Actuator System for Frequency Selective Vibration Monitoring. Actuator, Bremen, 2006 Jun 14-16; Proceedings, pp 928-931 (ISBN 3-933339-08-1) |
| Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Electrostatic Force Coupling of MEMS Oscillators for Spectral Vibration Measurements. Eurosensors XX, Göteborg (Sweden), 2006 Sept 17-20; Proceedings (digital), pp M2B-O2 (ISBN 91-631-9281-0) |
| Froemel,J.; Billep,D.; Gessner,T.; Wiemer,M.: Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Journal of Microsystem Technologies, 16, 8 (2006) pp 481-483 (ISSN 0946-7076) |
| Froemel,J.; Gessner,T.: Advanced packaging is the breakthrough technology of MEMS commercialisation. The 12th International Nanotech Symposium, Tokyo, 2006 Nov 8-10 |
| Fruehauf,S.; Schulz,S.E.; Gessner,T.: Mesoporous SiO2 as low-k dielectric for integration in Cu/low-k interconnect systems. Vacuums Best, (2006) pp 31-36 |
| Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Gelapierre,G.; Hiller,K.; Nestler,J.; Gessner,T.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Ross,S.; Bigot,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: Nanostructured polymer thin films : Application to biosensors. Nanomat 2006, Rio de Janeiro (Brazil), 2006 Jun 5-8 ; Proceedings |
| Gessner,T.; Baum,M.; Hiller,K.; Mehner,J.; Wiemer,M.; Otto,T.; Saupe,R.; Nestler,J.: Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanotechnologien. VDE Kongress 2006, Aachen (Germany), 2006 Oct 23-25; Proceedings, Band 1 (2006) pp 495-500 (ISBN 3-8007-2979-2) |
| Gessner,T.; Bonitz,J.; Kaufmann,C.; Kurth,S.; Specht,H.: MEMS based Micro Scanners: Components, Technologies and Applications. Actuator 2006, 10th International Conference on New Actuators, Bremen (Germany), 2006 June 14-16; Proceedings, pp 193-198 |
| Gottfried,K.; Schubert,I.: Ultra low-k integration – a challenge for CMP. CMP Nutzertreffen (CMP user meeting), Chemnitz, 2006 Oct 27 |
| Gottfried,K.; Schubert,I.: Ultra low-k integration – a challenge for CMP. Cabot Microelectronics CMP Meeting, Dresden, 2006 Jun 21 |
| Gottfried,K.; Schubert,I.: CMP processes for copper / porous low-k based damascene architectures. CMP User Meeting, München, 2006 Apr 7 |
| Gottfried,K.; Schubert,I.; Schulz,S.E.; Gessner,T.: Cu/barrier CMP on porous low-k based interconnect schemes. MAM, Grenoble (France), 2006 Mar 6-8; Microelectronic Engineering, 83 (2006) p 2218–2224 |
| Jia,C.; Wiemer,M.; Froemel,J.; Otto,T.; Gessner,T.: Low temperature adhesive bonding by using SU-8 photoresist. The 2nd International Workshop on Wafer Bonding for MEMS Technologies, Halle(Saale), Germany, April; Proceedings, pp 43-44 |
| Jia,C.; Wiemer,M.; Gessner,T.: Direct Bonding with On-wafer Metal Interconnections. J. Microsyst. Technol., 12 (2006) pp 391-396 |
| Jia,C.; Wiemer,M.; Otto,T.; Gessner,T.: Silicon Micromachined Membrane Actuator for Ultrasound Generation. The 10th International Conference on New Actuator (ACTUATOR06), Bremen, June; Proceedings, pp 227-230 (ISBN 3-933339-08-1) |
| Jia,C; Wiemer,M.; Grunert,J.; Otto,T.; Gessner,T: Micro-machined Capacitive Ultrasonic Transducer Array with Better Than One-percent Cell Uniformity. The 5th International Workshop on Micromachined Ultrasound Transducers, Munich, May |
| Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Parametric Finite Element Analysis for Reduced Order Modeling of MEMS. EuroSimE 2006 - 7th International conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Como (Italy), 2006 Apr 23-26; Proceedings, pp 220-225 (ISBN 1-4244-0275-1) |
| Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Parametric Simulation of MEMS Based on Automatic Differentiation of Finite Element Codes. Nanotech 2006 - NSTI Nanotechnology Conference and Trade Show , Boston (USA), 2006 May 7-11; Technical Proceedings, 3 (2006) pp 507-510 (ISBN 0-9767985-8-1) |
| Leidich,S.; Gessner,T.: Using Circuit and Electromagnetic Simulation Software in RF-MEMS Design Process. 3. AWR User Group Meeting, Munich, 2006 Oct 4-5 |
| Leidich,S.; Voigt,S.; Kurth,S.; Gessner,T.: Microwave Phase Shifter with Electromagnetic Signal Coupling in Silicon Bulk Technology. Int. J. Microwave and Optical Techn., 1 (2006) pp 1-9 (ISSN 1553-0396) |
| Nestler,J.; Hiller,K.; Gessner,T.; Buergi,L; Soechtig,J.; Ross,S.; Voirin,G.; Bigot,S.; Gavillet,J.; Getin,S.; Fillon,B.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: A new technology platform for fully integrated polymer based micro optical fluidic systems . 4M2006 - Second International Conference on Multi-Material Micro Manufacture, Grenoble (France), 2006 Sep 20-22; Proceedings, pp 35-38 (ISBN 0-080-45263-9) |
| Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Microfluidic bubble actuators based on hydrogels. uTAS2006 - 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, Tokyo, 2006 Nov 05-09; Proceedings, pp 657-659 (ISBN 4-9903269-0-3-C3043) |
| Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Mikrofluidischer Aktor, Aktorverfahren und Verfahren zum Herstellen eines Mikroaktors. Patentanmeldung (DE102006017482A1, EP1844936A1) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Bruch,R.; Gessner,T.: Principle and Applications of a new MOEMS-Spectrometer. MEMS/MOEMS Conference, San Jose, 2006; Proceedings of SPIE, 6114 (2006) pp 77-86 |
| Reuter,D.; Bertz,A.; Billep,D.; Scheibner,D.; Doetzel,W.; Gessner,T.: In-process gap reduction of capacitive transducers. Sensors and Actuators A, 126 (2006) pp 211-217 (ISSN 0924-4247) |
| Schulz,S.E.; Gessner,T.: Achieving ultra low dielectric constant for nanoelectronics interconnect systems, Invited talk . FORNEL Workshop, Wuerzburg, 2006 Mar 15 |
| Schulz,S.E.; Schulze,K.: Achieving ultra low k dielectric constant for nanoelectronics interconnect systems, Invited talk. 2006 8th International Conference on Solid-State and Integrated Circuit Technology, ICSICT-2006, Shanghai (China), 2006 Oct 23-26; pp 298-301 (ISBN Print version: 1-4244-0160-7; CD-ROM version: 1-4244-0161-5) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems (Talk). Advanced Metallization Conference (AMC), San Diego (USA), 2006 Oct 17-19 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity. Materials for Advanced Metallization (MAM), Grenoble (France), 2006 Mar 4-6; Microelectronic Engineering, Volume 83, Issues 11-12 (2006) pp 2324-2328 (ISSN 0167-9317) |
| Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Formation of Air Gap structures via wet etch removal of sacrificial dielectrics. Advanced Metallization Conference 2005, Colorado Springs CO, U.S.A., 2005 Sept 27-29; MRS Conf. Proc. AMC XXI, Material Research Society, Warrendale PA (2006), pp 309-316 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics (Talk). IEEE EDS Workshop on Advanced Electron Devices, Duisburg (Germany), 2006 June 13-14 |
| Voigt,S.; Leidich,S.; Kurth,S.; Gessner,T.; Doetzel,W.: 24 GHz RF-MEMS Phase Shifter with Non-Galvanic Electromagnetic Coupling Fabricated in Silicon-Bulk Technology. Journal of Physics: Conference Series, 34 (2006) pp 228-234 (ISSN 1742-6588) |
| Waechtler,T.; Gruska,B.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry. Talk given at the 4th Workshop on Ellipsometry, Berlin (Germany), 2006 Feb 20-22 (ISBN 978-3-00-018751-3) |
| Waechtler,T.; Gruska,B.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry. Talk given at the 8th International Conference on Solid-State and Integrated Circuit Technology, ICSICT-2006, Shanghai (China), 2006 Oct 23-26; Proceedings, pp 2184-2186 (ISBN Print version: 1-4244-0160-7; CD-ROM version: 1-4244-0161-5) |
| Waechtler,T.; Shen,Y.Z.; Jakob,A.; Ecke,R.; Schulz,S.E.; Wittenbecher,L.; Sterzel,H.-J.; Tiefensee,K.; Oswald,S.; Schulze,S.; Lang,H.; Hietschold,M.; Gessner,T.: Evaluation of Phosphite and Phosphane Stabilized Copper(I) Trifluoroacetates as Precursors for the Metal-Organic Chemical Vapor Deposition of Copper. Poster presented at the Materials for Advanced Metallization Conference - MAM 2006, Grenoble (France), 2006 Mar 6-8 |
| Zimmermann,S.; Zhao,Q.T.; Hoehnemann,H.; Wiemer,M.; Kaufmann,C.; Mantl,S.; Dudek,V.; Gessner,T.: Different approaches to integrate patterned buried CoSi2 layers in SOI substrates. Materials for Advanced Metallization (MAM), Grenoble (France), 2006 March 4-6; Microelectronic Engineereing, Volume 83, Issues 11-12 (2006) pp 2112-2116 (ISSN 0167-9317) |
