| Ahner,N.; Schaller,M.; Bartsch,C.; Baryschpolec,E.; Schulz,S.E.: Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions. 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Bruges (Belgium), 2008 Sep 21-24; Proceedings, pp 119-120 |
| Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectronic Engineering, 85 (2008) pp 2111-2113 (ISSN 0167-9317) |
| Ahner,N.; Schulz,S.E.; Prager,L.; Schaller,M.: UV assisted curing of plasma damaged porous ultralow-k material after a k-restore process: influence of UV-wavelength and curing ambient. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25 |
| Baum,M.; Otto,T.; Gessner,T.; Keiper,B.; Haenel,J.: Mikrofluidische Schnittstellen durch Laserstrukturierung. Mikroproduktion, 01/2008 (2008) pp 24-28 (ISBN ISSN 1614-4538) |
| Baum,M.; Rota,A.; Salk,N.; Otto,T.; Gessner,T.: Micro machining technologies for non silicon materials. Smart Systems Integration 2008, Barcelona (Spain), 2008 April 9-10 pp 395-398 (ISBN 978-3-8007-3081-0) |
| Forke,R.; Scheibner,D.; Hiller,K.; Gessner,T.; Doetzel,W.; Mehner,J.: Fabrication and Characterization of a Force Coupled Sensor-Actuator System for Adjustable Resonant Low Frequency Vibration Detection. Sensors and Actuators A: Physical, 145-146 (2008) pp 245-256 |
| Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Electrostatic force coupling of MEMS oscillators for spectral vibration measurements. Sensors and Actuators A: Physical, 142, 1 (2008) pp 276-283 |
| Froemel,J.; Voigt,S.; Kurth,S.; Leidich,S.; Bertz,A.; Kaufmann,C.; Gessner,T.: Micromechanical Switch Device with Mechanical Power Amplification. Patentschrift WO002008110389A1, DE102007013102A1 |
| Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Gelapierre,G.; Hiller,K.; Nestler,J.; Gessner,T.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Ross,S.; Bigot,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: Nanostructured polymer thin films: Application to
biosensors. Materials Science Forum, 570 (2008) pp 10-17 (ISSN 0255-5476) |
| Gessner,T.; Schulze,K.; Schulz,S.E.: Thermal behaviour of BEOL systems: Comparison of SiO2, low-k and airgap Integration (Invited Talk). 10th International Workshop on Stress-Induced Phenomena in Metallization
, Austin TX (USA), 2008 Nov 5-7 |
| Griffiths,C.; Tosello,G.; Nestler,J.; Sha,B.; Hoyle,R.: Micro Engineering: Experiments conducted on the use of polymeric materials in micro injection moulding. 1st European Conference on Medical Polymers, Belfast (UK), 2008 Sep 3-5; Proceedings, pp 171-178 (ISBN 978-0-853899433) |
| Haenel,J.; Keiper,B.; Baum,M.: Lasermikrostrukturierung von dünnen Polymersubstraten. Inno - Fachmagazin für Mikro- und Nanotechnik und neue Materialien, Nr. 39, 13. Jahrgang (2008) p 7 |
| Haenel,J.; Keiper,B.; Bleul,K.; Kaufmann,C.; Bonitz,J.: Laser Trimming of Micro Mirror Devices. Laser Technik Journal, 5 (2008) pp 36-39 (ISSN 1613-7728) |
| Hermann,S.; Ecke,R.; Schulz,S.E.; Gessner,T.: Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications . MAM 2008, Dresden (Germany), 2008 Mar 8-11; Microelectronic Engineering, Volume 85, Issue 10 (2008) pp 1979-1983 |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Growth of Multi-Walled Carbon Nanotubes on different Support/Catalyst Systems for Interconnect Applications. Ninth International Conference on
the Science and Application of Nanotubes - NT08, Montpellier (France), 2008 Jun 29-Jul 4 |
| Herrmann,M.; Richter,F.; Schulz,S.E.: Study of Nano-mechanical Properties for Thin Porous Films
through Instrumented Indentation: SiO2 Low Dielectric Constant Films as an Example. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectronic Engineering, 85 (2008) pp 2172-2174 (ISSN 0167-9317) |
| Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition. Proceedings, Advanced Metallization Conference 2007, Mater. Res. Soc. Conf. Proc. AMC XXIV (2008) pp 623-630 (ISBN 978-1-55899-992-3 / ISSN 1048-0854) |
| Jakob,A.; Shen,Y.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Riedel,R.; Fasel,C.; Lang,H.: Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) -- Synthesis, Properties, and their Use as CVD Precursors. Z. Anorg. Allg. Chem., 634 (2008) pp 2226-2234 (ISSN 0044-2313) |
| Jia,C.; Froemel,J.; Wiemer,M.: Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen. Laser Magazin, 06/2008 (2008) pp 50-51 |
| Jia,C.; Wiemer,M.; Hiller,K.; Otto,T.; Gessner,T.: Fabrication of a Low-Frequency Ultrasonic Transducer. Smart Systems Integration 2008, Barcelona (ES), April; Proceedings, pp 443-446 (ISBN 978-3-8007-3081-0) |
| Leidich,S.; Gessner,T.; Riemer,T.: In-Plane-Resonator for NMR Spectroscopy of nano Liter Samples. Experimental Nuclear Magnetic Resonance Conference, Pacific Grove (USA), 2008 Mar 9-14; Proceedings |
| Leidich,S.; Kurth,S.; Gessner,T.: Continuously Tunable RF-MEMS Varactor for High Power Applications. IEEE MTT-S International Microwave Symposium, Atlanta (USA), 2008 Jun 15-20; Proceedings, pp 1267-1270 |
| Leidich,S.; Riemer,T.; Braun,M.; Kurth,S.; Gessner,T.: Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy of Nano Liter Amounts of Biological Sample Material. Smart Systems Integration, Barcelona (Spain), 2008 Apr 9-10; Proceedings, pp 466-469 (ISBN 978-3-8007-3081-0) |
| Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Theoretical study of electronic transfer through gold and copper quantum point contacts. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25 |
| Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Electronic transport properties in copper nanowire. Microelectronic Eng., 85, 10 (2008) pp 1992-1994 |
| Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Theoretical study of electron transfer through copper and gold nanowires. Nanoelectronics Day, Aachen (Germany), 2008 May 13-16; Poster Presentation |
| Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Quantum conductance of copper nanowires. DPG, Berlin (Germany), 2008 Feb 25-29; Poster Presentation |
| Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Electronic transport properties in copper nanowire. MAM, Dresden (Germany), 2008 Mar 2-5; Poster Presentation |
| Morschhauser,A.; Nestler,J.; Baum,M.; Schueller,M.; Jaenig,O.; Otto,T.; Gessner,T.: Fabrication of Magnetic Polymer Membranes with microfluidic functionality. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 807-810 (ISBN 3-933339-10-3) |
| Nestler,J.; Enderlein,T.; Hiller,K.; Otto,T.; Gessner,T.; Auerswald,J.; Knapp,H.F.; Griffiths,C.; Bigot,S.: Microfluidic cartridge with integrated pumps and liquid position feedback designed for running protein assays. uFlu2008, 1st European Conference on Microfluidics, Bologna, 2008 Dec 10-12; Proceedings |
| Nestler,J.; Hiller,K.; Gessner,T.; Gavillet,J.; Auerswald,J.; Knapp,H.F.; Griffiths,C.; Bigot,S.; Beckers,M.-C.: An all-polymer microfluidic system for protein sensing applications with integrated low-cost pumps, surface modification and sealing. Smart Systems Integration 2008, Barcelona (ES), 2008 Apr 9-10; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2008), pp 291-298 (ISBN 978-3-8007-3081-0) |
| Nestler,J.; Hiller,K.; Morschhauser,A.; Bigot,S.; Griffiths,C.; Auerswald,J.; Gavilllet,J.; Nonglaton,G.; Otto,T.; Gessner,T.: Low-cost, fully integrated liquid handling platform for protein assays. uTAS2008 - 12th Internationl Conference on Miniaturized Systems for Chemistry and Life Sciences, San Diego (USA), 2008 Oct 12-16; Proceedings, pp 411-413 (ISBN 978-0-9798064-1-4) |
| Nestler,J.; Hiller,K.; Morschhauser,A.; Schueller,M.; Otto,T.; Gessner,T.: Low-cost micro valves based on electrolysis inside hydrogels. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 214-217 (ISBN 3-933339-10-3) |
| Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Micro Actuators based on Structured Water. MST-News (international magazine on smart systems integration), June 2008 (2008) pp 18-21 |
| Nestler,J.; Schueller,M.; Morschhauser,A.; Baum,M.; Otto,T.; Gessner,T.: Mikropumpe und Verfahren zum Pumpen eines Fluids. Patentanmeldung (DE102008004147) |
| Nestler,J.; Schueller,M.; Morschhauser,A.; Otto,T.; Gessner,T.: Vorrichtung und Verfahren zum Hin- und Herbewegen einer Flüssigkeit über eine vorbestimmte Fläche. Patentschrift (DE102008004139) |
| Norman,J.A.T.; Perez,M.; Schulz,S.E.; Waechtler,T.: New precursors for CVD copper metallization. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectron. Eng., 85 (2008) pp 2159-2163 (ISSN 0167-9317) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Wiesner,K.; Lampe,U.; Fleischer,M.; Gessner,T.: Dual detector optical MEMS spectrum analyzer: advances, applications and prospects. MEMS/MOEMS Conference, San Jose, 2008; Proceedings of SPIE, 6882 (2008) |
| Otto,T.; Saupe,R.; Weiss,A.; Throl,O.; Stock,V.; Gessner,T.: Fuel Gas Determination Using a MEMS Gas Analyser. Actuator 2008, Bremen, 9-11 June 2008 pp 782-785 (ISBN 3-933339-10-3) |
| Reuter,D.; Bertz,A.; Nowack,M.; Gessner,T.: Thin film encapsulation technology for harms using sacrificial CF-polymer. Sensors and Actuators A: Physical, 145-146 (2008) pp 316-322 |
| Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Silver, Copper and Ruthenium Precursors for ALD and CVD – An Overview. GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 2008 Sep 22-23 |
| Rudra,S.; Waechtler,T.; Friedrich,M.; Louis,S.J.; Himcinschi,C.; Zimmermann,S.; Schulz,S.E.; Silaghi,S.; Cobet,C.; Esser,N.; Gessner,T.; Zahn,D.R.T.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. phys. stat. sol. (a), 205 (2008) pp 922-926 (ISSN 0031-8965) |
| Saupe,R.; Otto,T.; Gruska,B.; Weiss,A.; Stock,V.; Gessner,T.: MEMS-based spectroscopic ellipsometry. Smart Systems Integration 2008, Barcelona, 9-10 April 2008 pp 277-284 (ISBN 978-3-8007-3081-4) |
| Schueller,M.; Nestler,J.; Morschhauser,A.; Otto,T.; Gessner,T.: Low cost valveless magnetic micropumps suitable for array applications. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 811-813 (ISBN 3-933339-10-3) |
| Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behavior, reliability. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25 |
| Semar,R.; Bertz,A.: Active Smart ID-Label für die Transportüberwachung
. Clustermeeting RFID: Smart Label in der Logistik, Berlin, 5./6. November |
| Shaporin,A.; Forke,R.; Schmiedel,R.; Doetzel,W.: Test-Structures for Wafer Level Microsystems Characterization. Smart Systems Integration, Barcelona (Spain), 2008 Apr 9-11; Proceedings, pp 528-531 (ISBN 978-3-8007-3081-0) |
| Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers. Proceedings, Advanced Metallization Conference 2007, Mater. Res. Soc. Conf. Proc. AMC XXIII (2008) pp 23-29 (ISBN 978-1-55899-992-3 / ISSN 1048-0854) |
| Waechtler,T.; Oswald,S.; Roth,N.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.: Atomic Layer Deposition of Ultra-Thin Copper and Copper Oxide Films for ULSI Metallization Purposes. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25 |
| Waechtler,T.; Oswald,S.; Roth,N.; Lang,H.; Schulz,S.E.; Gessner,T.: ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices. 8th International Conference on Atomic Layer Deposition (ALD 2008), Bruges (Belgium), 2008 Jun 29 - Jul 2 |
| Waechtler,T.; Roth,N.; Oswald,S.; Lang,H.; Schulz,S.E.; Gessner,T.: Atomic layer deposition of copper and copper oxide thin films for applications in microelectronic metallization systems. GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 2008 Sep 22-23 |
| Waechtler,T.; Schulz,S.E.: Copper Oxide and Copper Thin Films Grown by ALD for Seed Layer Applications (Invited Talk). Twenty Fifth International VLSI Multilevel Interconnection Conference (VMIC), Fremont, California (USA), 2008 Oct 28-30; Proceedings, p 365 |
| Wiemer,M.; Froemel,J.; Haubold,M.; Jia,C.; Wuensch,D.; Gessner,T.: Developments Trends in the Field of Wafer Bonding Technologies. 214th Meeting of the Electrochemical Society, Honolulu, Hawai, 2008 October 12-17; ECS Transactions, Volume 16 Issue 8 (2008) |
| Zimmermann,S.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as insitu diagnostic methods. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25 |
