| Almeida,M.; Matthes,P.; Ueberschaer,O.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Laser Based Exchange Bias Setting Influence on Spin-Valve Sensors Magnetic Properties. Spinicur Summer School, Braga (Portugal), 2015 Sep 7-11; Proceedings |
| Almeida,M.; Ueberschaer,O.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Innovative 2D GMR sensors in monolithic integration for high-sensitivity applications. Nanotech 2015, Tokyo (Japan), 2015 Jan 26 - 30 |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Gessner,T.; Salvan,G.; Zahn,D.R.T.: TSCuPc/Au Hybrid Trench Devices: a Comparative Study of Solution Processed and Thermally Evaporated Molecular Channels. DPG Spring Meeting , Berlin, 2015 Mar 15-20 |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Gessner,T.; Zahn,D.R.T.; Salvan,G.: Photosensitive Organic / Inorganic Hybrid Trench Devices for Sensor Applications. ECME 2015, Strasbourg (France), 2015 Sep 1-5 |
| Baum,M.; Wang,W.-S.; Vogel,K.; Hofmann,L.; Devadass,N.K.; Roscher,F.; Wiemer,M.; Gessner,T.: Optimization of surface pretreatments for oxide removal prior to Cu-Cu thermocompression bonding. Conference for Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Braunschweig,Germany, 7-9 December, 2015 |
| Billep,D.; Schulze,R.; Gessner,T.: Sensormodul mit Weckeinrichtung / Sensor module with waking device / Module capteur comprenant un dispositif réveil. EP 2 646 837 B1 |
| Blaudeck,T.; Adner,David; Hermann,S.; Lang,Heinrich; Gessner,T.; Schulz,S.E.: Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach. Microelectronic Engineering, 137 (2015) pp 135-140 |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Length separation of single-walled carbon nanotubes and influence on CNT-FET properties. IEEENano, Rome, 2015 Jul 27-30 |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Towards Giant Piezoresistance – Process Improvements for Highly Sensitive CNT-based-Sensors. IMTC 2015 Leigtweight Structures, Chemnitz, 2015 Oct 1-2; Conference Proceedings (ISBN 978-3-95735-025-1) |
| Dhakal,D.; Georgi,C.; Ecke,R.; Assim,K.; Schulz,S.E.; Bruener,P.; Grehl,T.; Lang,H.; Gessner,T.: XPS and LEIS investigations of ultrathin Cu2O deposited by atomic layer deposition and subsequent reduction to Cu. 18. Tagung Festkörper Analytik, Wien, 2015 July 6-8 |
| Dhakal,D.; Hu,X.; Georgi,C.; Schuster,J.; Ecke,R.; Schulz,S.E.; Gessner,T.: Growth Monitoring by XPS and LEIS Investigations of Ultrathin Copper Films Deposited by Atomic Layer Deposition. Symposium of the ALD-Lab, SEMICON Europa, Dresden, 2015 Oct 06-08 |
| Ebermann,M.; Neumann,N.; Binder,S.; Meinig,M.; Seifert,M.; Kurth,S.; Hiller,K.: A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases. 18th International Conference on Solid-State Sensors, Actuators and Microsystems, Anchorage, 2015 Jun 21-25; Proceedings of TRANSDUCERS, pp 2037-2040 (ISBN 978-1-4799-8955-3) |
| Ebermann,M.; Neumann,N.; Hiller,K.; Seifert,M.; Meinig,M.; Kurth,S.: Enhanced resolution Fabry-Pérot microspectrometers. IRS², Nürnberg, 2015 May 19-21; Proceedings IRS², pp 913-917 (ISBN 978-3-9813484-8-4) |
| Enderlein,T.; Nestler,J.; Otto,T.; Gessner,T.: Fabrication of Micro Needle arrays using an Ultra short pulse Laser. Smart System Integration, Copenhagen, 2015 Mar 11-12; Proceedings, pp 388-391 (ISBN ISBN 978-3-86359-296-7) |
| Fischer,T.; Heinrich,K.; Spudat,C.; Martin,J.; Otto,T.; Gessner,T.; Kroll,L.: Quantum dot-based sensor layer in lightweight structures. Microelectronik Engineering – Nanotechnology and Processing for electronics, MEMS, Energy, Life Sciences, 146 (2015) pp 57-61 (ISSN 0167-9317) |
| Foerster,A.; Koehler,N.; Zimmermann,S.; Fischer,T.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.; Gessner,T.: Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Poster; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Foerster,A.; Wagner,C.; Gemming,S.; Schuster,J.: Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation. Journal of Vacuum Science & Technology B , 33, 5 (2015) p 052203 |
| Foerster,A.; Wagner,C.; Schuster,J.; Gemming,S.: Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics. MAM/IITC, Grenoble, 2015 May 18-21; Microelectronic Eng. |
| Foerster,A.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.: k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study . DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Talk; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Forke,R.; Hiller,K.; Hahn,S.; Konietzka,S.; Motl,T.; Koehler,D.; Heinz,S.; Billep,D.; Gessner,T.: Yet Another Tuning Fork Gyroscope. IEEE International Symposium on Inertial Sensors and Systems (ISISS 2015), Hapuna Beach, HI (USA), 2015 Mar 23-26; Proceedings, pp 5-8 |
| Franz,M.; Ecke,R.; Kaufmann,C.; Kriz,J.; Schulz,S.E.: Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys. IITC/MAM, Grenoble, 2015; 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), pp 95-98 (ISBN 978-1-4673-7356-2) |
| Froemel,J.; Baum,M.; Wiemer,M.; Gessner,T.: Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism. Journal of Microelectromechanical Systems (JMEMS), Vol. 24, 6 (2015) pp 1973-1980 (ISBN ISSN: 1057-7157 ) |
| Gaitzsch,M.; Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Kurth,S.; Gessner,T.; Baumann,R.R.; Kroll,L.: Efficient K-Band Antennas Fabricated with Large-Scale-Processes. 2nd International MERGE Technologies Conference, Chemnitz (Germany), 2015 Oct 1-2 |
| Gaitzsch,M.; Voigt,S.; Haas,S.; Kurth,S.; Gessner,T.: RF MEMS Switch for Modulated Backscatter Communication. MEMSWAVE 2015, Barcelona, 2015 June 30; Proceedings of MEMSWAVE 2015, pp 78-80 (ISBN 978-84-943928-7-0) |
| Gessner,T.; Otto,T.; Schulz,S.E.; Hermann,S.; Blaudeck,T.; Spudat,C.: Vorrichtungen zur Aussendung und/oder zum Empfang elektromagnetischer Strahlung und Verfahren zur Bereitstellung derselben
. DE102013221758 (A1) |
| Grossmann,T.D.; Gaitzsch,M.; Hartwig,M.; Heinrich,M.; Symmank,C.; Schmidt,A.; Kurth,S.; Gessner,T.; Baumann,R.R.; Kroll,L.; Goetze,U.: Remote Ice Detection on Rotor Blades of Wind Turbines. 2nd International MERGE Technologies Conference, Chemnitz (Germany), 2015 Oct 1-2; Proceedings, pp 265-271 (ISBN 978-3-95735-025-1) |
| Han,J.; Lin,Y.-C.; Chen,L.; Tsai,Y.-C.; Ito,Y.; Guo,X.; Hirata,A.; Fujita,T.; Esashi,M.; Gessner,T.; Chen,M.: On-Chip Micro-Pseudocapacitors for Ultrahigh Energy and Power Delivery. Advanced Science, 2, 5 (2015) p 1500067 |
| Hann,J.; Helke,C.; Nestler,J.; Billep,D.; Gessner,T.: Nanoxerography and Electrical Nanoimprint Lithography for Optimization of Thermoelectric Properties of PEDOT:PSS. Workshop on µ-contact-printing and nanoimprint lithography Dresden, Dresden, Mar 09; Proceedings, p 25 |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of integrated carbon nanotubes. 3rd Dresden Nanoanalysis symposium 2015, 2015 April 17 |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of
the structural properties of integrated carbon nanotubes. DPG 2015, 2015 Mar 15-20 |
| Hartmann,Steffen; Shaporin,A.; Hermann,S.; Bonitz,J.; Heggen,Marc; Markert,M.; Meszmer,Peter; Sturm,Heinz; Hoelck,Ole; Blaudeck,T.; Schulz,S.E.; Mehner,J.; Wunderle,B.; Gessner,T.: Towards Nanoreliability of CNT based Sensor Applications: Investigations of Carbon Nanotube-Metal Interfaces Combining Molecular Dynamics Simulations, Advanced In-Situ Experiments and Analytics. 16th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Budapest, 2015 April 19-22; Proceedings (ISBN 978-1-4799-9949-1) |
| Hartwig,M.; Gaitzsch,M.; Heinrich,M.; Grossmann,T.D.; Kroll,L.; Gessner,T.; Baumann,R.R.: Printing of conductive patterns for application in smart lightweight structures. Smart Systems Integration 2015, Copenhagen (Denmark) |
| Hartwig,M.; Gaitzsch,M.; Heinrich,M.; Grossmann,T.D.; Kroll,L.; Gessner,T.; Baumann,R.R.: Inkjet and gravure printing of conductive patterns for the application in lightweight structures. Printing Future Days, Chemnitz (Germany), 2015 Oct 5-7; Proceedings (ISBN 978-3-86135-626-4) |
| Hartwig,M.; Mischke,A.; Gaitzsch,M.; Grossmann,T.D.; Heinrich,M.; Kurth,S.; Kroll,L.; Gessner,T.; Baumann,R.R.: Inkjet and gravure printed conductive grid patterns for the application in functional lightweight structures. 581. Wilhelm und Else Heraeus-Seminar on Flexible, Stretchable and Printable High Performance Electronics, Bad Honnef (Germany) |
| Helke,C.; Nestler,J.; Gessner,T.: Surface patterning and self-assembly of DNA-Origami based
transistor nanoarchitectures. Smart Systems Integration, Copenhagen, Mar 11-12; Proceedings, pp 410-413 (ISBN 978-3-86359-296-7) |
| Hermann,S.; Bonitz,J.; Boettger,S.; Hartmann,S; Shaporin,A.; Mehner,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Carbon Nanotube based sensors in MEMS/NEMS. SSI, Copenhagen, 2015 Mar 11-12 |
| Hille,Toni; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Optimizing Dispersion Preparation for the Wafer-Level Deposition of CNTs. DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Hofmann,C.; Baum,M.; Bodny,F.; Wiemer,M.; Gessner,T.; Brunschwiler,T.; Zuercher,J.; Burg,B.R.; Zimmermann,S.: Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects. Smart Systems Integration 2015, Copenhagen (DK), 2015 Mar 11-12; Proceedings, 9th (2015) pp 85-92 (ISBN 978-3-86359-296-7) |
| Hofmann,L.; Dempwolf,S.; Reuter,D.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Knechtel,R.; Gessner,T.: 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding. SPIE Microtechnologies, Barcelona, Spain, 2015 May ; Proceedings of SPIE, 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 951709 (2015) |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. International Wafer-Level-Packaging Conference, San Jose, CA, USA, 2015 October 13-15; SMTA Proceedings |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface. Microelectronic Engineering, 137, 2 (2015) pp 23-31 |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate: a combined first-principles and reactive molecular dynamics study. Physical Chemistry Chemical Physics, 17 (2015) pp 26892-26902 |
| Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.; Gessner,T.: Reactive Molecular Dynamics Study of Copper Metal and Copper Oxide Atomic Layer Deposition from Copper(II) Acetylacetonate. 15th International Conference on Atomic Layer Deposition (ALD 2015), Portland (USA), June 28 - July 02 |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNTs growth: Comparative study on characterization techniques for an effective CVD process Development. NT, Nagoya(Japan) |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNT growth: Investigation of catalyst type, composition and structure. MC2015, Güttingen(Germany), 2015 Sep 7-11 |
| Kalbacova,Jana; Rodriguez,Raul D.; Blaudeck,T.; Hermann,S.; Adner,David; Lang,Heinrich; Schulz,S.E.; Zahn,Dietrich R.T.: Probing the structure of carbon nanotube bundles: A Raman spectroscopy study with metal nanoparticles. Optical Nanospectroscopy II, Dublin, 2015 Mar 18-20; Proceedings |
| Kaspar,M.; Waechtler,T.; Ecke,R.; Georgi,C.; Schulz,S.E.; Lang,H.; Gessner,T.: A Novel Dicobaltatetrahedrane Precursor Studied for the MOCVD of Cobalt Metal Layers (Poster). Materials for Advances Metalization (MAM), Grenoble, 2015 May 18 - 21 |
| Kasper,Laura; Adner,David; Blaudeck,T.; Hermann,S.; Lang,Heinrich; Schulz,S.E.: Wafer-level decoration of carbon nanotubes with preformed gold nanoparticles for optical sensing. 3rd Erlangen Symposium on Synthetic Carbon Allotropes (SCA 2015), Erlangen, 2015 Oct 04-07; Verhandlungen |
| Kasper,Laura; Alam Bhuiyan,Ifte Khairul; Adner,David; Kalbacova,Jana; Blaudeck,T.; Rodriguez,Raul D.; Hermann,S.; Zahn,Dietrich R.T.; Lang,Heinrich; Schulz,S.E.: Characterization of Gold-Decorated Carbon Nanotube Field-Effect Transistors in Planar Device Geometry. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Kasper,Laura; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Wafer-level fabrication and characterization of photosensitive CNT-FETs . DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Lin,Y.; Tsai,Y.-C.; Ono,T.; Liu,P.; Esashi,M.; Gessner,T.; Chen,M.: Metallic glass as a mechanical material for micro scanners. Advanced Functional Materials, 25, 35 (2015) p 5677–5682 |
| Matthes,P.; Almeida,M.; Mueller,M.; Ebert.R.; Ecke,R.; Ueberschaer,O.; Exner,H.; Schulz,S.E.: Laser Induced Exchange Bias Realignment Enabling a Monolithic Integration of More Dimensional Magnetic Field Sensors. ILACOS - International Laser And Coating Symposium, Dresden (Germany), 2015 Oct 7; Proceedings |
| Matthes,P.; Almeida,M.; Ueberschaer,O.; Mueller,M.; Ebert,R.; Ecke,R.; Exner,H.; Schulz,S.E.: GMR based 2D magnetic field sensors. SEMNICON Europa, Dresden (Germany), 2015 Oct 6-8; Proceedings |
| Mehta,Ninad; Hille,Toni; Singh Thakur,Dheeraj; Sheremet,Evgeniya; Blaudeck,T.; Schulze,Steffen; Hermann,S.; Hietschold,Michael; Schulz,S.E.: Spectroscopic Monitoring and Data Evaluation of Carbon Nanotube Dispersion Preparation. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Meinecke,C.; Mueller,M.; Rennau,M.; Bertz,A.; Ebert,R.; Reuter,D.; Exner,H.; Gessner,T.: Micro welding of aluminum for post process electrode gap reduction using femtosecond laser. 18th International Conference on Solid-State Sensors, Actuators and Microsystems Transducers 2015, Anchorage, AK (USA), 2015 June 21-25; Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference, pp 1354-1357 |
| Meinecke,C.; Mueller,M.; Rennau,M.; Reuter,D.; Ebert,R.; Bertz,A.; Exner,H.; Gessner,T.: Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochaüflösenden Sensorsystemen. Mikrosystemtechnik-Kongress, Karlsruhe, 2015 Oct 26. - 28.; Proceedings, pp 559-562 (ISBN 978-3-8007-4100-7) |
| Meinig,M.; Kurth,S.; Helke,C.; Seifert,M.; Hiller,K.; Ebermann,M.; Neumann,N.; Gessner,T.: Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration. Smart Systems Integration, Copenhagen, 2015 Mar 11-12; Proceedings, pp 204-211 (ISBN 978-3-86359-296-7) |
| Moebius,M.; Ma,X.; Martin,J.; Doty,M.F.; Otto,T.; Gessner,T.: Photoluminescence quenching of InP/ZnS quantum dots by charge injection. SPIE, San Francisco, 2015 Feb 7-12; Proceedings of SPIE, 9370 (2015) |
| Mothes,R.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: [Ag{S2CNR(C2H4OH)}] as Single-Source Precursor for Ag2S – Synthesis, Decomposition Mechanism, and Deposition Studies. European Journal of Inorganic Chemistry, 2015, 10 (2015) p 1726–1733 |
| Ortlepp,F.; Hartwig,M.; Moebius,M.; Martin,J.; Otto,T.; Gessner,T.; Baumann,R.R.: Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring. 6th International Scientific Conference on Print and Media Technology, Chemnitz (Germany), 2015 Oct 5-7; Proceddings of Printing Future Days 2015, pp 147-148 (ISBN 978-3-86135-626-4) |
| Otto,T.; Geidel,S.; Morschhauser,A.; Streiter,R.; Gessner,T.; Heibutzki,B.; Nestler,J.: Mobile communication and control for Smart Microfluidic Systems. International Conference on Signal Processing and Communication (ICSC), 2015, Noida, Uttar Pradesh (INDIA), 2015 Mar 16-18 pp 177-182 (ISBN 978-1-4799-6760-5) |
| Pérez,N.; Melzer,M.; Makarov,D.; Ueberschaer,O.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.: High-performance GMR sensorics on flexible Si membranes. Applied Physics Letters, 106, 15 (2015) |
| Roscher,F.; Seifert,T.; Baum,M.; Wiemer,M.; Gessner,T.: Printed metallic nanoparticles as intermediate layers for low temperature wafer level packaging an as an alternative towards conventional wire bonding. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Braunschweig, Germany, 7-9 December, 2015 |
| Roscher,F.; Seifert,T.; Wiemer,M.; Gessner,T.: Additive Manufacturing for zero and first level packaging of Electronics and MEMS using Aerosol-Jet Deposition of Metal Nanoparticles. Semiconductor Technology International Conference (CSTIC), Shanghai (China), 2015 Mar 15-17 |
| Rupprecht,J.; Kurth,S.; Hiller,K.; Seifert,M.; Besser,J.; Meinig,M.; Ebermann,M.; Neumann,N.; Gessner,T.: Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters. Materials Today: Proceedings, 2, 8 (2015) pp 4280-4288 |
| Schueller,M.; Lipowski,M.; Schirmer,E.; Walther,M.; Symmank,C.; Schmidt,A.; Kroll,L.; Gessner,T.; Goetze,U.: Fluidic actuators in composite structures: design, manufacturing, and life cycle-related evaluation. IMTC 2015, Chemnitz, 2015 Oct 1-2 |
| Seifert,T.; Baum,M.; Roscher,F.; Wiemer,M.; Gessner,T.: Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects. nanoFIS 2014 - Functional Integrated nanoSystems, Graz (Austria), 2014 Dec 3-5; Materials Today: Proceedings, 2, 8 (2015) pp 4262-4271 (ISSN 2214-7853) |
| Sowade,Enrico; Blaudeck,T.; Baumann,R.R.: Inkjet Printing of Colloidal Nanospheres: Engineering the Evaporation-Driven Self-Assembly Process to Form Defined Layer Morphologies
. Nanoscale Research Letters, 2015, 10 (2015) p 362 (ISSN 1556-276X) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Strong localization in defective carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Strong localization in quasi one-dimensional systems with realistic defects: application to carbon nanotubes. Psi-K 2015 Conference, San Sebastian (Spain), 2015 Sep 6-10; Poster presentation; Abstract in: Psi-K Conference 2015 Abstract Book |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Ecke,R.; Mueller,M.; Exner,H.; Schulz,S.E.: Innovative 2D spin valve sensors in monolithic integration for high-sensitivity compass applications. 13th Symposium Magnetoresistive Sensors and Magnetic Systems, Wetzlar (Germany), 2015 Mar 3-4; Proceedings |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications. SPIE Optics + Photonics, San Diego (USA), 2015 Aug 9-13; Proceedings |
| Vogel,K.; Wiemer,M.; Gessner,T.; Vogel,J.; Lin,Y.-C.; Tsai,Y.-C.; Esashi,M.; Tanaka,S.: Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application. The Smart Systems Integration (SSI2015), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 240-247 (ISBN 978-3-86359-296-7) |
| Wagner,C.; Schuster,J.; Gessner,T.: Carbon nanotubes under strain: Electronic and Optical properties. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Talk; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Wang,W.-S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Fabrication of Nanoporous Gold and the Application for Substrate Bonding at Low Temperature. Japanese Journal of Applied Physics, 54, 3 (2015) p 030215 (ISSN 0021-4922) |
| Weidlich,S.; Forke,R.; Billep,D.; Konietzka,S.; Koehler,D.; Hiller,K.; Gessner,T.: Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen. Mikrosystemtechnik Kongress, Karlsruhe, 2015 Okt 26-28; Proceedings, pp 595-598 (ISBN 978-3-8007-4100-7) |
| Wright,D.N; Taklo,M.M.V.; Baum,M.; Hofmann,C.; Kristiansen,H.: Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres. IMAPS Nordic, Helsingor (DK), 2015 Jun 9; Proceedings |
| Zienert,A.; Schuster,J.; Gessner,T.: Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts. The AIMR International Symposium 2015, Sendai (Japan), 2015 Feb 16-19 |
| Zuercher,J.; Yu,K.; Schlottig,G.; Baum,M.; Taklo,M.M.V.; Wunderle,B.; Warszynki,P.; Brunschwiler,T.: Nanoparticle assembly and sintering towards all-copper flip chip interconnects . Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th , San Diego, CA, 2015 May 23-26 ; Proceedings, 65th (2015) pp 1115-1121 (ISSN 15304236 ) |
