| Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. Solid State Phenomena, 187 (2012) pp 201-205 (ISSN 1012-0394) |
| Arekapudi,P.K.; Reuter,D.; Lehmann,D.; Zahn,D.R.T.: Structural and Electrical Characterization of 3D Gate Organic Field Effect Transistor . Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Balaj,I.; Raschke,R.; Baum,M.; Uhlig,S.; Wiemer,M.; Gessner,T.; Grafe,J.: Development of transfer Electrostatic Carriers (T-ESC) for thin 300 mm wafer handling using seal glass bonding technology. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 53 (2012) (ISBN 978-3-8007-3423-8) |
| Baum,M.; Besser,J.; John,B.; Keiper,B.; Haenel,J.; Wiemer,M.; Gessner,T.: Micro hot embossing and micro laser welding technologies for fluidic applications. Micromechanics and Microsystems Europe Workshop MME 2012, Ilmenau, 2012 Sep 9-12; Proceedings, Paper 1673, A 12 (2012) (ISBN 978-3-938843-71-0) |
| Besser,J.; Baum,M.; Wiemer,M.; Gessner,T.; Sanchez-Ordonez,S.; Thanner,C.; Vetter,C.: Thermal and UV nanoimprint lithography for applications from the micro to the nano scale. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 28 (2012) (ISBN 978-3-8007-3423-8) |
| Ebermann,M.; Neumann,N.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Widely tunable Fabry-Perot filter based MWIR and LWIR microspectrometers. Next-Generation Spectroscopic Technologies V, Baltimore, Maryland, USA, 2012 Apr 23-24; Proceedings of SPIE, 8374 (2012) p 83740X (ISBN 9780819490520) |
| Ebermann,M.; Neumann,N.; Hiller,K.; Meinig,M.: Spektral abstimmbare IR-Sensoren für die industrielle Prozessmesstechnik und die medizinische Gasanalyse. tm - Technisches Messen Plattform für Methoden, Systeme und Anwendungen der Messtechnik, 79, 10 (2012) p 440–450 |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. ICNFA, Montreal, 2012 Aug 7-9; Talk |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. Proceedings of the 3rd International Conference on Nanotechnology: Fundamentals and Applications (ISBN 978-0-9867183-3-5) |
| Fiedler,H.; Melzer,M.; Waechtler,T.; Hermann,S.; Schulz,S.E.; Gessner,T.: Nanomaterials for Interconnects. 8th Interregional Workshop on Advanced Nanomaterials (IWAN 2012), Frankfurt (Oder) (Germany), 2012 Nov 12-13 |
| Fiedler,H.; Toader,M.; Hermann,S.; Rennau,M.; Schulz,S.E.; Hietschold,M.; Gessner,T.: Fabrication and characterization of CNT via interconnects for application in integrated circuits. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30; Talk (ISBN Abstract in: Verh. Dtsch. Phys. Ges. (ISSN 0420-0195)) |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Sheremet,E.; Rennau,M.; Schulze,S.; Waechtler,T.; Hietschold,M.; Zahn,D.R.T.; Schulz,S.E.; Gessner,T.: Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects. ECS Journal of Solid State Science and Technology, 1, 6 (2012) pp M47-M51 (ISSN 2162-8769) |
| Fischer,T.; Prager,L.; Hohage,J.; Ruelke,H.; Schulz,S.E.; Richter,R.; Gessner,T.: A two-step UV curing process for producing high tensile stressed silicon nitride layers. MRS Spring Meeting, San Francisco; 2012 MRS Spring Meeting Proceedings |
| Fischer,T.; Schulz,S.E.; Gessner,T.; Prager,L.; Hohage,J.; Ruelke,H.; Richter,R.: A complimentary study of vacuum ultraviolet curing procedures on high tensile stress SiXNYHZ PECVD silicon nitride layers. JVST:B |
| Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. Thin Solid Films, 520, 14 (2012) pp 4741-4744 (ISSN 0040-6090) |
| Geidel,S.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Otto,T.; Gessner,T.: Laserbasierter Multilayer-Fügeprozess zur Erzeugung heterogener und druckstabiler mikrofluidischer Systeme. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2012 Oct 23-24; Proceedings (ISBN 978-3-00-039162-0) |
| Gessner,T.; Schulz,S.E.; Waechtler,T.; Lang,H.; Jakob,A.: Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition und Verwendung des Verfahrens. Patent, DE 10 2007 058 571 B4 (2012) |
| Gessner,Thomas; Koehler,Thomas: Smart Systems Integration - short review and further development of smart systems. Smart Systems Integration SSI2012, Zurich (Switzerland), 2012 Mar 21 - 22; Proceedings (CD-ROM), Paper 0, 2012 |
| Gordan,O.D.; Lehmann,D.; Haidu,F.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Lang,H.; Braun,W.; Gessner,T.; Zahn,D.R.T: Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Harazim,S.; Helke,C.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Sanchez,S.; Grimm,D.; Otto,T.; Schmidt,O.; Gessner,T.: LoC Integrationsstrategien für aufgerollte Sensoren. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings, pp 147-152 (ISBN 978-3-00-039162-0) |
| Hartwig,I.: Akustische Oberflächenwellen zur Bestimmung der Haftfestigkeit dünner Schichten . 16. Deutsche Physikerinnentagung (DPT), Freiburg i. Br.(Germany), Oct 25-28; Talk |
| Haubold,M.; Lin,Y.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.: A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface. Microsystem Technologies |
| Heinrich,H.; Schulze,R.; Wegener,M.; Kroll,L.; Walther,M.; Schueller,M.; Gessner,T.: Micro Injection Moulded MEMS with Integrated Piezoelectric PVDF. 1st Joint International Symposium on System Integrated Intelligence 2012: New Challenges for Product and Production Engineering, Hannover (Germany), 2012 Jun 27-29; Proceedings , pp 201-203 |
| Helke,C.; Schueller,M.; Hiller,K.; Schulze,R.; Braeuer,J.; Nestler,J.; Otto,T.; Gessner,T.: Bonding technologies for standard bulk PZT
ceramics without the need of after process polarization
especially on thin silicon membranes. Actuator, Bremen, 2012 Jun 18-20; Proceedings, pp 705-708 (ISBN 978-3-933339-19-5) |
| Hermann,S.; Bonitz,J.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Shaporin,A.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Herrenhausen Conference „Downscaling Science“ , Hanover (Germany), 2012 Dec 12-14 |
| Hermann,S.; Fiedler,H.; Loschek,S.; Schulz,S.E.; Gessner,T.: Processes for wafer level integration of carbon nanotubes in
electronic and sensor applications. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings (ISBN 9783000391620) |
| Hermann,S.; Fiedler,H.; Yu,H.; Loschek,S.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications. Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Systems, Signals and Devices (SSD), 2012 9th International Multi-Conference on (ISBN 978-1-4673-1589-0) |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration in Interconnects and MEMS/NEMS. Advanced metallization conference 2012, Albany, 2012 Oct 9-11; Invited Talk |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Novel form of carbon nanotube films with a self-assembled carbon-metal heterostructure. Vth International Conference on Molecular Materials, Barcelona (Spain), 2012 Jul 03-06 |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration beyond CMOS and MEMS/NEMS. INC8 - International Nanotechnology Conference on Communication and Cooperation, Tsukuba; invited Talk, 2012 May 8-11 |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schaefer,P.; Zahn,DRT; Albrecht,M.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure. Carbon, 50, 13 (2012) pp 4765-4772 (ISSN 0008-6223) |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schulz,S.E.; Gessner,T.: Novel carbon nanotube film with a self-assembled carbon-metal
heterostructure. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Jia,C.; Reuter,D.; Wen,Zhiyu; Baum,M.; Wiemer,M.; Gessner,T.: FEM simulation and its application in MEMS design . Proceedings of 2011 Semiconductor Conference Dresden (SCD) , Dresden, 27-28 Sept. 2011 (ISBN 978-1-4577-0431-4 ) |
| Kuechler,M.: Vergleichende Charakterisierung von Ätzanlagen; Profilneigung—tilt. 2. Workshop "Tiefes Siliziumätzen", Chemnitz, Fraunhofer ENAS, 2012 Apr 17 |
| Kurth,S.; Hiller,K.; Meinig,M.; Gessner,T.: Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy. Mikrosystemtechnik in Deutschland 2012, pp 48-49 (ISSN 2191-7183) |
| Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Specht,H.; Meinig,M.; Gessner,T.: Fabry-Perot tunable infrared filter based on structured reflectors. SPIE Photonics Europe, Brussels, 2012 Apr 16-20; Proc. of SPIE, 8428 (2012) p 84281O |
| Lee,J.-W.; Kawai,Y.; Tanaka,S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Fabrication of Freestanding Pb(Zr,Ti)O Film Microstructures Using Ge Sacrificial Layer. Japanese Journal of Applied Physics, 51, 2R (2012) pp 021502-1-021502-3 |
| Martin,J.; Staudinger,U.; Demir,E.; Spudat,C.; Poetschke,P.; Voit,B.; Otto,T.; Gessner,T.: Nanosensor technology based on semiconductor nanocrystals. SPIE Photonics West, San Francisco (USA), 2012 Jan 21-26; Proceedings SPIE, 8264 (2012) p 82641M |
| Melzer,M.; Foerster,A.; Waechtler,T.; Wagner,C.; Fiedler,H.; Schuster,J.; Hermann,S.; Schulz,S.E.; Gessner,T.: Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Copper oxide ALD on thermally pretreated CNTs for interconnect applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Messerschmid,M.; Schleunitz,A.; Spreu,C.; Werner,T.; Vogler,M.; Reuther,F.; Bertz,A.; Schift,H.; Gruetzner,G.: Thermal Nanoimprint Resist for the Fabrication of High-Aspect-Ratio Patterns . Microelectronic Engineering, 98 (2012) pp 107-111 |
| Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Lang,H.; Zahn,D.R.T.; Gessner,T.: An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Nestler,J.; Enderlein,T.; Geidel,S.: Laser Micromachining for Micro- and Lab-on- Chip-Systems. ILACOS (International Laser and Coating Symposium), Dresden (Germany), 2012 Oct 17-18 |
| Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Micro arc welding for electrode gap reduction of high aspect ratio microstructures. Sensors and Actuators A: Physical, 188 (2012) pp 495-502 |
| Raukopf,S.; Gebhardt,C.; Roscher,F.; Baum,M.; Kinner,R.; Wiemer,M.; Gessner,T.: Si Interposer Technologies for three dimensional AMR Sensor Systems. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, p Paper 40 (ISBN 978-3-8007-3423-8) |
| Reuter,D.; Ghosh,J.; Rennau,M.; Hiller,K.; Salvan,G.; Fronk,M.; Zahn,D.R.T.; Bof Bufon,C.C.; Schmidt,O.G.: I-V Characteristics of Copper Phthalocyanine Based Laterally Stacked Devices Fabricated by Semiconductor Processing. Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Reuter,D.; Nowack,M.; Shaporin,A.; Rockstroh,J.; Haas,S.; Bertz,A.; Mehner,J.; Gessner,T.: Out of Plane Capacitive Transducer in Air Gap Insulation Microstructures Technology for High Precision Monolithic 3-Axis Sensors. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8 ) |
| Rodriguez,R.D.; Toader,M.; Hermann,S.; Mueller,S.; Gordan,O.D.; Yu,H.; Schulz,S.E.; Hietschold,M.; Zahn,D.R.T.: Nanoscale Optical and Electrical Characterization of Aligned
Semiconducting Single-Walled Carbon Nanotubes in a Field Effect Transistor. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Roscher,F.; Braeuer,J.; Baum,M.; Besser,J.; Wiemer,M.; Seifert,T.; Gessner,T.: Nanotechnologien im Packaging – Neue Materialien und Verfahren für die Mikrosystemtechnik. Mikro-Nano-Integration - 4. GMM-Workshop, Berlin, 2012 Nov 12-13; GMM-Fb. 74: Mikro-Nano-Integration (ISBN 978-3-8007-3473-3) |
| Salvan,G.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Salvan,G.; Fronk,M.; Robaschik,P.; Zahn,D.R.T.; Albrecht,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.: Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Schmeisser,M.; Schuster,J.; Schulz,S.E.; Auer,A.: Quantum chemical modeling of basic reaction steps for the
reduction of ALD-grown copper oxide films. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden, 2012 June 17-20; Poster |
| Schulze,R.; Gessner,T.; Schueller,M.; Forke,R.; Billep,D.; Heinrich,M.; Sborikas,M.; Wegener,M.: Integration of Piezoelectric Polymer Transducers
into Microsystems for Sensing Applications. Applications of Ferroelectrics held jointly with 2012 European Conference on the Applications of Polar Dielectrics and 2012 International Symp Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials (ISAF/ECAPD/PFM), 2012 Intl Symp, Aveiro (Portugal), 2012 Jul 9-13 pp 1-4 (ISBN 978-1-4673-2668-1 ) |
| Schuster,J.; Mohammadzadeh,S.; Streiter,R.; Wagner,C.; Zienert,A.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Nanodevices. Nanofair 2012, Dresden, June 13; Talk |
| Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact
Metallization and Stress Liner Technologies for Strained Silicon. Materials for Advanced Metallization Conference (MAM), Grenoble, 2012 Mar 11-14; Talk, Book of Abstracts |
| Schuster,J.; Streiter,R.; Wolf,H.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Equipment and Processes for the Deposition of Thin Films
. SEMICON Europa , Dresden, Oct 9-11; Talk |
| Sickmann,J.; Schuster,J.; Richter,R.; Wuerfel,A.; Geisler,H.; Engelmann,H.-J.; Lichte,H.: Strain mapping of tensile strained transistors by dark-field off-axis electron holography. Proceedings of 15th European Microscopy Congress (EMC), Manchester, September,16th - 21st ; Poster |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Poster presentation; Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Sommer,J.; Zienert,A.; Schuster,J.: Band structure und electronic transport properties of cobalt decorated carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Poster presentation; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Streit,P.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: Comparison of lumped and finite element modeling for thermoelectric devices. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.:International Confererence on Superlattices, Nanostructures and Nanodevices, Dresden (Germany), 2012 Jul 22-27 |
| Toader,M.; Fiedler,H.; Schulz,S.E.; Hietschold,M.: Conductive AFM for CNTs characterisation. DPG Frühjahrstagung, Berlin, 2012 Mar 25-30; Poster |
| Tsai,Y.-C.; Lin,Y.-C.; Abe,T.; Esashi,M.; Gessner,T.: RIE Patterning Technology of Zr-based Metallic Glass for MEMS Devices Fabrication. IEEE Sensors, Taipei (Taiwan), 2012 Oct 28-31; Proceedings, pp 339-342 (ISBN 1930-0395, 978-1-4577-1766-6 (print)) |
| Tuchscherer,A.; Georgi,C.; Roth,N.; Schaarschmidt,D.; Rueffer,T.; Waechtler,T.; Schulze,S.E.; Oswald,S.; Gessner,T.; Lang,H.: Ruthenocenes and Half-Open Ruthenocenes: Synthesis, Characterization, and Their Use as CVD Precursors for Ruthenium Thin Film Deposition. Eur. J. Inorg. Chem., 2012, 30 (2012) pp 4867-4876 (ISSN 1099-0682) |
| Vogel,K.; Baum,M.; Roscher,F.; Kinner,R.; Rank,H.; Mayer,T.; Wiemer,M.; Gessner,T.: Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2012, Oktober 23-24; Proceedings, pp S5-2, 6S. (ISBN 978-3-00-039162-0) |
| Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Mechanical characterization of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June ; Proceedings of 11th Youth Symposium on experimental solid mechanics, pp 239-245 (ISBN 978-606-19-0078-7) |
| Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Influence of test speed on the bonding strength of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June 2; Abstract Book of 11th Youth Symposium on experimental solid mechanics, pp 100-101 (ISBN 978-606-19-0079-4) |
| Vogel,M.; Braeuer,J.; Wiemer,M.; Nestler,J.; Kurth,S.; Otto,T.; Gessner,T.: Smart Systems for Different Applications from Fraunhofer ENAS. in: Mikrosystemtechnik in Deutschland 2012, pp 72-73 (ISSN 2191-7183) |
| Voigt,S.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. 3. Landshuter Symposium Mikrosystemtechnik, Landshut, 2012 Mar 13-14 |
| Voigt,S.; Kurth,S.; Gessner,T.: Autonomous sensor network for power line monitoring. SSI - Smart System Integration Conference, Zürich, 2012 Mar 21-22 |
| Voigt,S.; Pfeiffer,M.; Grolms,A.; Kurth,S.; Keutel,T.; Brockmann,C.; Braunschweig,M.: Autarkes Sensornetzwerk zum Monitoring von Hochspannungsleitungen. Chemnitzer Fachtagung Mikrosystemtechnik – Mikromechanik & Mikroelektronik, Chemnitz, 2012 Oct 23-24 |
| Voigt,S.; Wolfrum,J.; Pfeiffer,M.; Keutel,T.; Brockmann,C.; Grosser,V.; Lissek,S.; During,H.; Rusek,B.; Braunschweig,M.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. , VDE-Kongress Smart Grid - Intelligente Energieversorgung der Zukunft, Stuttgart, 2012 Nov 5-6 |
| Waechtler,T.: Atomic Layer Deposition Processes for Integration in ULSI Metallization Systems and Spintronic Sensor Devices. SEMICON Europa 2012, Dresden, 2012 Oct 9-11 |
| Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: FIB/SEM Analysis for Smart Systems Integration. Smart Systems Integration (SSI 2012), Zürich (Switzerland), 2012 Mar 21-22 |
| Waechtler,T.; Mueller,S.; Fiedler,H.; Melzer,M.; Schulz,S.E.; Gessner,T.: ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 2012 Mar 7 |
| Wagner,C.; Schuster,J.; Gessner,T.: DFT simulations for CNT sensors. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk |
| Wang,W.-S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Substrate bonding at low temperature by using plasma activated porous gold. IEEE Sensors, Taipei (Taiwan), 2012 Oct 28-31; Proceedings, pp 335-338 (ISBN 978-1-4577-1765-9, 978-1-4577-1766-6 (print)/1930-0395) |
| Wen,Q.; Schulze,R.; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: The Design of Vortex Induced Vibration Fluid Kinetic Energy Harvesters. PowerMEMS, Atlanta (USA), 2012 Dec 02-05; Proceedings PowerMEMS, pp 243-246 |
| Wuensch,D.; Hofmann,Ch.; Besser,J.; Schubert,I.; Gottfried,K.; Wiemer,M.; Gessner,T.: 3D Integration for MEMS devices using photosenitive glass. SSI, Zurich (Switzerland), 2012 March 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum transport simulations in metallic carbon nanotubes with metal contacts. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. MolMat, Barcelona (Spain), 2012 Jul 3-6; Poster presentation |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit
Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk, Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit
Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Zimmermann,S.; Ahner,N.; Fischer,T.; Oszinda,T.; Uhlig,B.; Schulz,S.E.; Gessner,T.: A Low Damage Patterning Scheme for Ultra Low-k Dielectrics. Future Fab International, vol. 42 (2012) pp 94-101 |
