Publikationen
2024 | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
Jahr 2017
| Arnold,B.; Meinecke,C.; Reuter,D.; Otto,T.; Mehner,J.: Design, Herstellung und Charakterisierung von hochpräzisen Beschleunigungssensoren, gefertigt mittels HARMS Technologie und integrierter Elektrodenabstandsverringerung . MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 582-585 (ISBN ISBN 978-3-8007-4491-6) |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Mehner,J.: Development of a high-precision MEMS tilt sensor for navigation systems in robot-assisted surgery. BMTMedPhys 2017, Dresden (Germany), 2017 Sep 10-13; Biomed. Eng.-Biomed. Tech., 62(s1): (2017) pp 27-31 |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Mehner,J.; Otto,T.: Design, fabrication and characterization of a high-precision MEMS tilt sensor for surgical robot navigation . European Medical and Biological Engineering Conference (EMBEC) & Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere (Finland), 2017 Jun 11-15; Proceedings, p 167ff |
| Arnold,M.; Viogt A.; Haas,S.; Schwenzer F.; Schwenzer,G.; Reuter,D.; Gruetzner G.; Hiller,K.: Novel negative tone spray-coatable photoresist for photolithography processing over high topographical steps. Smart System Integration 2017, Cork, 08.03.-09.03; Proceedings, p 8 |
| Arnold,M.; Voigt A.; Haas,S.; Schwenzer F.; Schwenzer,G.; Reuter,D.; Gruetzner G.; Gessner,T.: Spray-coatable negative photoresist for high topography MEMS applications. Journal of Micromechanics and Microengineering, 27, 035016 (2017) p 9 |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Zahn,D.R.T.; Salvan,G.: Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions. Beilstein J. Nanotechnol., 8 (2017) p 1502–1507 |
| Banerjee,S.; Buelz,D.; Solonenko,D.; Reuter,D.; Deibel,C.; Hiller,K.; Zahn,D.R.T.; Salvan,G.: HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes. Nanotechnology, 28, 19 (2017) |
| Baum,M.; Froemel,J.; Wang,W.-S.; Wiemer,M.; Otto,T.: CU-CU LOW TEMPERATURE BONDING WITH SURFACE PRE-TREATMENT METHODS. WaferBond, Leuven (Belgien), 2017 Nov 27-29; Proceedings, pp 39-40 |
| Baum,M.; Wuensch,D.; Hiller,K.; Forke,R.; Hahn,S.; Reuter,D.; Wiemer,M.; Otto,T.: Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9 ; Proceedings (ISBN 978-1-944543-01-3) |
| Berner,T.; Schulze,R.; Shaporin,A.; Forke,R.; Otto,T.: MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 594-597 (ISBN 978-3-8007-4491-6) |
| Blaudeck,T.; Hermann,S.; Hartmann,M.; Boettger,S.; Tittmann-Otto,J.; Heldt,G.; Reuter,D.; Schulz,S.E.: Scalable Fabrication of Carbon Nanotube Field-Effect Transistors. New Directions in Biocomputation, Dresden, 2017 Sep 12-13; Abstract Book, pp 37-38 |
| Buja,Oana-M.; Gordan,Ovidiu D.; Leopold,Nicolae; Morschhauser,A.; Nestler,J.; Zahn,Dietrich R.T.: Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate. Beilstein J. Nanotechnol, 2017, 8 (2017) p 237–243 |
| Foerster,A.; Wagner,C.; Schuster,J.; Friedrich,J.: Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes - An alternative initial step. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 35 (2017) p 01B113 |
| Ghosh,J.; Reuter,D.; Salvan,G.: I-V Characteristics of CuPc-based Laterally Stacked Nanostructures Fabricated by Semiconductor Processing. Nanofim 2017, Uttar Pradesh, India, 2017 Nov 16-17 |
| Hartmann,M.; Toader,M.; Schubel,R.; Jordan,R.; Schulz,S.E.; Hermann,S.: Performance enhancement of carbon nanotube FETs via polymer-based doping control. Trends in Nanotechnology (TNT), Dresden (Germany), 2017 June 5-9; Talk |
| Helke,C.; Hiller,K.; Erben,J.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: an example for Match 1:1-, eBeam-, and nanoimprint lithography. 33rd European Mask and Lithography Conference, Dresden, 2017 Jun 26-27; Proceedings, Vol. 10446 (2017) pp 1-9 |
| Helke,C.; Hiller,K.; Werner,T.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers. SPIE Optics+Photonics/ Nanoengineering: Fabrication, Properties, Optics, and Devices XIV, San Diego (USA), 2017 Aug 5-10; Proceedings, Vol.10354 (2017) pp 1-11 |
| Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.: Galvanische Abscheidung von Aluminium für die Mikrosystem- und Leiterplattentechnik. MikroSystemTechnik Kongress , Unterschleißheim, 23.-25.10.2017; Proceedings , pp 666-669 (ISBN 978-3-8007-4491-6) |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. Journal of Surface Mount Technology, 30, 1 (2017) pp 1-8 |
| Hofmann,L.; Reuter,D.; Wuensch,D.; Hiller,K.; Schulz,S.E.: Emerging 3D integration technologies for MEMS fabrication (invited talk) . MEMS Manufacturing, Santa Clara (USA), 2017 Aug 2-3; Proceedings |
| Hofmann,L.; Zienert,A.; Schuster,J.; Schulz,S.E.: Elektrochemische Pulsstromabscheidung von Kupfer für Si-Durchkontakte in MEMS: Experiment und Simulation. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, p 4 (ISBN 978-3-8007-4491-6) |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive molecular dynamics simulations of metallic Cu and Cu oxides ALD. Joint EuroCVD-21 BalticALD-15, Linkoping, 2017 June 11-14 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive dynamics simulation of metallic Cu and Cu oxide ALD from the (nBu3P)2Cu(acac) precursor. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper. The Journal of Physical Chemistry C, 121, 50 (2017) pp 28077-28089 |
| Jafarpour,S.; Kini.M; Hermann,S.; Schulz,S.E.: Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes. Microelectronic Eng., 176 (2017) p 95–104 |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: Design of a 2D MEMS Micromirror with Indirect Static Actuation. IEEE Sensors 2017 Conference, Glasgow (UK), 2017 Oct 29-Nov 1; Proceedings (ISBN 978-1-5090-1012-7) |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: A Novel Gyroscopic Actuation Concept for 2D MEMS Micromirrors. Eurosensors Conference 2017, Paris (France), 2017 Sep 3-6; Proceedings, 1, 4 (2017) p 546 |
| Koehler,N.; Liedke,M.O.; Attallah,A.G.; Butterling,M.; Anwand,W.; Wagner,A.; Krause-Rehberg,R.; Schulz,S.E.: Investigation of pore and network formation in spin-on ultra low-k dielectrics by spectroscopic techniques. Advanced Metallization Conference, Austin, TX (USA), Sept. 13-14; Poster presentation |
| Kuechler,M.; Reuter,D.: Fluidik-Chips—ein neues Forschungswerkzeug in den Geowissenschaften. Evaporations-Workshop, TU Freiberg, Institut für Bohrtechnik und Fluidbergbau, Agricola-Strasse 22, Freiberg, 2017-Okt-23 |
| Langenickel,J.; Meyer,M.; Weiss,A.; Otto,T.: Integration of LEDs based on Quantum Dots within Lightweight Structures. IMTC, Chemnitz, 2017 Sep 21; Proceedings |
| Langenickel,J.; Weiss,A.; Otto,T.: Influence of processing atmosphere for QD-LEDs. Smart Systems Integration, Cork, 2017 Mar 08; Proceedings |
| Liedke,M.O.; Koehler,N.; Butterling,M.; Attallah,A.G.; Krause-Rehberg,R.; Hirschmann,E.; Schulz,S.E.; Wagner,A.: In-situ investigations of the curing process in ultra low-k materials. 12th International Workshop on Positron and Positronium Chemistry, Lublin (Poland), Aug. 28 - Sept. 1; Talk |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Multilayer Micromechanics Process with Thick Functional Layers (EPyC40). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 296 |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Silicon Sacrificial Layer Technology for the Production of 3D MEMS (EPyC Process). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 295 |
| Luo,J.; Cerretti,G.; Krause,B.; Zhang,L.; Otto,T.; Jenschke,W.; Ullrich,M.; Tremel,W.; Voit,B.; Poetschke,P.: Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: switching from p-type to n-type by the addition of polyethylene glycol. Journal Polymer 108 (2017), pp 513-520 |
| Martin,J.; Shetty,K.; Reimann,N.; Neukirchner,S.; Fuegmann,U.; Illing-Guenther,H.; Nestler,D.; Huebler,A.C.; Nendel,K.; Kroll,L.; Otto,T.: Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics. 3rd International MERGE Technologies Conference , Chemnitz (Germany), 2017 Sept 21-22; Proceedings, p 121 (ISBN 978-3-95735-066-4) |
| Meinecke,C.; Till Korten; Heldt,G.; Reuter,D.; Stefan Diez: Fabrication and Operation of Kinesin-1-Powered Biocomputation Networks. New Directions in Biocomputation, Dresden, 2017 Sep 12-13; Abstract Book, p 21 |
| Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.: Detection of mechanical loads in lightweight structures using quantum dots photoluminescence. Smart Systems Integration, Cork (Ireland), 2017 Mar 08; Proccedings, pp 423-426 (ISBN 978-3-95735-057-2) |
| Pleul,M.; Meinecke,C.; Streit,P.; Albers,J.; Kuerschner,R.; Schubert,E.; Reuter,D.; Otto,T.: Robuster Vibrationssensor zur Zustandsüberwachung an Schienenfahrzeugen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 840-843 (ISBN ISBN 978-3-8007-4491-6) |
| Pleul,M.; Streit,P.; Polster,K.; Schulze,R.; Schuh,A.; Meinecke,C.; Reuter,D.: Robust vibration Sensor for condition monitoring in railway appli-cations. Smart Systems Integration, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 443-446 |
| Popova,I.; Lestev,A.; Fedorov,M.; Rakityansky,O.; Ivanov,V.; Semenov,A.; Forke,R.; Shaporin,A.; Hiller,K.; Koehler,D.; Konietzka,S.: Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches. Smart Systems Integration, Cork (Irland), 2017 Mar 8-9; Proceedings, pp 378-381 (ISBN 978-3-95735-057-2) |
| Rost,F.; Arnold,B.; Decker,R.; Mehner,J.; Kroll,L.; Rzepka,S.; Otto,T.: Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 858-861 (ISBN ISBN 978-3-8007-4491-6) |
| Schroeder,T.; Baum,M.; Wuensch,D.; Wiemer,M.; Otto,T.: 3D packaging for an implantable hemodynamic control system. BMTMedPhys 2017, Dresden (Germany), 2017 Sept 11-13; Biomedical Engineering / Biomedizinische Technik, 62, S1 (2017) p S356 (ISBN ISSN (Online) 1862-278X, ISSN (Print) 0013-5585) |
| Schroeder,T.; Wuensch,D.; Baum,M.; Hiller,K.; Wiemer,M.; Otto,T.; Weidenmueller,J.; Oezgue,D.; Utz,A.; Goertz,M.: 3D Packaging Technologies for Smart Medical Implants. Smart Systems Integration Conference, Cork, Ireland, 2017 Mar 8-9; Proceedings, pp 41-47 (ISBN 978-3-95735-057-2) |
| Selbmann,F.; Baum,M.; Hecker,C.; Roscher,F.; Enderlein,T.; Wiemer,M.; Joseph,Y.; Otto,T.: Investigations on Parylene C for its Integrability into MEMS. Smart Systems Integration SSI, Cork, Irland, 2017 Mar 8-9; Proceedings |
| Selbmann,F.; Hofmann,L.; Baum,M.; Roscher,F.; Wiemer,M.; Schulz,S.E.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for MEMS applications. Materials for Advanced Metallization (MAM), Dresden, Mar. 26-29; Proceedings |
| Selbmann,F.; Saeidi,N.; Mohandas,P.M.; Baum,M.; Wiemer,M.; Jerke,M.; Joseph,Y.; Otto,T.: Thin film encapsulations for medical applications. Mikrosystemtechnikkongress, München, 2017 Oct 23-25; Proceedings |
| Sommer O.; Arnold,M.; Reuter,D.; Hiller,K.; Wozniak,G.: Latest investigations of the Fat-Edge/Edge-Thinning effect in coating processes. Tagungsband zum XXIII internationalen Symposium "Research-Education-Technology", pp 167-173 (ISBN 978-3-9817740-2-3) |
| Sophia Dempwolf; Hofmann,L.; Christopher Bowers; Daniela Guenther; Roy Knechtel; Schulz,S.E.; Ronny Gerbach: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors. International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo (Japan), 2017 May 16-18; Proceedings |
| Stiehl,C.; Enderlein,T.; Otto,T.; Nestler,J.: Novel concept of integrated micro actuation of membranes in liquid environments. Smart Systems Integration, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 487-490 (ISBN 978-3-95735-057-2) |
| Streit,P.; Nestler,J.; Schulze,R.; Shaporin,A.; Otto,T.: Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system. 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, 2017 Apr 2-5; Proceedings |
| Teichert,F.; Wagner,C.; Croy,Alexander; Schuster,J.: Influence of defect-induced deformations on electron transport in carbon nanotubes. Materials for Advanced Metallization, Dresden (Germany), 2017 Mar 26-29; Poster presentation; Abstract in: MAM 2017 Abstract Book |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects. Journal of Computational Physics, 334 (2017) pp 607-619 (ISSN 0021-9991) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime. Computational Materials Science, 138 (2017) pp 49-57 (ISSN 0021-9991) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: DFTB-based recursive Green’s function algorithms for electron transport in quasi-1D systems. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electron transport in defective metallic and semiconducting carbon nanotubes: An improved RGF-based O(N) approach. International Workshop on Computational Nanotechnology, Windermere (United Kingdom), 2017 Jun 5-9; Poster presentation; Abstract in: Abstract Book |
| Tittmann-Otto,J.; Hartmann,M.; Ullrich,J.; Schulz,S.E.; Hermann,S.: Charge traps in carbon nanotube-based field-effect transistors. Workshop on Charge Trappung Defects in Semiconductors and Insulators, York, UK, 2017 Mar 20-21; Proceedings, 2017 (2017) p 24 |
| Wagner,C.; Schuster,J.: Modellierung axial verspannter CNT-Transistoren für Sensoren. Mikrosystemtechnik Kongress 2017 (MST 2017) „MEMS, Mikroelektronik, Systeme“, Unterschleißheim bei München (Germany), 2017 Oct 22-24; Poster, Proceedings, p 556 (ISBN 978-3-8007-4491-6) |
| Wagner,C.; Schuster,J.; Schleife,André: Excitonic effects in strained Carbon nanotubes. ETSF Young Researchers’ Meeting, Tarragona (Spain), 2017 Jun 05-09; Talk, Proceedings |
| Wagner,C.; Schuster,J.; Schreiber,Michael; Schleife,André: Ab initio calculations and strain-dependent scaling of excitons in carbon nanotubes. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk, Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Wecker,J.; Kurth,S.; Meinig,M.; Otto,T.; Bauch,A.; Weigel,R.; Kissinger,D.; Hackner,A; Prechtel,U.: Millimeterwellen-Sensorsystem zur Messung der Sauerstoffkonzentration in Gasen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 120-123 (ISBN 978-3-8007-4491-6) |
| Willert,A.; Zichner,R.; Thalheim,R.; Baumann,R.R.; Otto,T.: Go Beyond 4.0 – Towards Digital Fabrication Based on Printing. IMTC 2017 Lightweight Structures, 3rd International MERGE Technologies Conference, Chemnitz (Germany), 2017 Sept 21-22; KB Poster and other (ISBN 978-3-95735-066-4) |
| Wuensch,D.; Martinka,R.; Schubert,I.; Baum,M.; Wiemer,M.; Otto,T.: Temporary wafer bonding - key technology for MEMS devices. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9; Proceedings (ISBN 978-1-944543-01-3) |
| Wuensch,D.; Wiemer,M.; Otto,T.: TEMPORARY WAFER BONDING USING ROOM TEMPERATURE MECHANICAL RELEASE FOR MEMS DEVICES. WaferBond, Leuven, 2017 Nov 27-29; Proceedings, pp 57-58 |
| Zienert,A.; Hofmann,L.; Schuster,J.; Schulz,S.E.: TSV Metallization without Additives by Periodic Pulse Reverse Plating. 2017 Advanced Metallization Conference (AMC), Austin (TX), 2017 Sep 13-14; Oral Presentation |
